Industrial
Nexperia now offer GaN FETs in compact SMD packaging CCPAK
Nexperia has announced that its GaN FET devices, featuring next-gen high-voltage GaN HEMT technology in proprietary copper-clip CCPAK surface mount packaging, are now available to designers of industrial and renewable energy applications.
ASMPT launches CMAT-S high-speed camera production system
CMAT-S is an all-in-one system for assembling and dynamically aligning lenses in ADAS cameras.
Speed and precision for SiPs
The SIPLACE TX micron is the answer to the challenges manufacturers face in SiP (system-in-package) production.
Ersa unveils the POWERFLOW ULTRA
The POWERFLOW ULTRA is the latest from Ersa’s wave soldering product portfolio it has unveiled.
WEBER-HYDRAULIK strength in agricultural technology
From 12th to 18th November, WEBER-HYDRAULIK presented its hydraulic solutions for agriculture at AGRITECHNICA in Hannover.
$3M to boost state-of-the-art solar manufacturing
A new project spearheaded by the University of Michigan, supported by a $3 million grant from the National Science Foundation, is set to advance semiconductor technology, with significant implications for solar cells and LEDs.
Renesas introduces 32-bit RX MCU
Renesas has expanded its 32-bit microcontroller (MCU) offering with a new RX device for high-end industrial sensor systems.
A.R.T. invests in latest solder and rework technology
Advanced Rework Technology Ltd (A.R.T.) has recently upgraded facilities at its Essex headquarters and training centre with an investment worth in excess of £30k.
congatec new rugged 13th Gen Intel Core COMs with soldered RAM
congatec has introduced six new COM Express Compact Computer-on-Modules based on 13th Gen Intel Core processor featuring high ruggedness.
Experimenting with Industrial Automation Design Challenge
Element14, in collaboration with Schneider Electric, has announced the ‘Experimenting with Industrial Automation Design Challenge’.