Aerospace & Defence

Mini-MRP solution improves reliability for Aerospace rack systems

11th May 2016
Jordan Mulcare

Molex, LLC has introduced its Mini-MRP (Modular Rack Principle) System, which improves reliability and reduces failure rates for modular rack systems in aerospace applications and other harsh-environment industries. Unique angled rear insulators eliminate the ingress of dew and water, significantly reducing short circuits, while also simplifying access and delivering the smallest possible PCB footprint.

In aerospace and defence applications, customers commonly struggle with space constraints on PCBs for the EN4165-mateable interconnects necessary for connecting modular racks. Contamination of contacts soldered to the PCB is also an issue, particularly via dew, which can occur when altitudes and temperatures change, leading to short circuits.

The fully-integrated Mini-MRP system, which can include PCB connector modules and boxes, delivers the smallest possible footprint for modular rack connectors, saving valuable PCB space. Its angled rear insulator design protects contacts from pull-out and torsion, dispels capillary forces and provides easy accessibility for inspection and application of hydrophobic protective coating. This serves to eliminate the ingress of dew, and enables much more efficient inspection and maintenance.

“Our new Mini-MRP system, which is compliant to the upcoming ARINC 836 amendment standard, provides an effective solution for aerospace and defence customers who need a reliable connector system that eliminates the threat of dew, while also improving accessibility and reducing the PCB footprint,” said Thomas Heller, account manager for aerospace and defence, Molex. “And because Molex provides a fully-integrated system solution for modular rack applications, delivering both the interconnect system as well as the corresponding housing, customers can reduce the number of suppliers by using one system.”

The PCB connectors are intermateable with theEN4165 rack connector harness, meeting the RTCA (Radio Technical Commission for Aeronautics) DO-160 environmental conditions and test procedures for airborne equipment as well as the FST (Fire, Smoke and Toxicity) requirements of major OEMs. Typical applications include cabin networks, in-flight-entertainment or other sub-systems, and other harsh-environment conditions.

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