Industries

ReVerb Networks has announced it will build its new line of digital integrated antenna arrays using Axis Network Technology’s WiMAX and LTE Multiple Input Multiple Output – MIMO – digital and RF platform.

Alpha Micro Components has announced the SAGEM HiLoNC module to its portfolio of networking products. The new component is the smallest of its kind and hosts a range of essential features for Machine-to-machine (M2M) applications and is ideal for use in the automotive and security markets.

Alpha Micro Components has announced the SAGEM HiLoNC module to its portfolio of networking products. The new component is the smallest of its kind and hosts a range of essential features for Machine-to-machine (M2M) applications and is ideal for use in the automotive and security markets.

Fujitsu Microelectronics Europe (FME) has announced the MB86K23, a Mobile WiMAX baseband device targeting the expanding mobile PC market. MB86K23 is the next-generation of the successful MB86K21, which targeted embedded WiMAX in mobile PCs or in WiMAX PC cards and which has been certified by the WiMAX Forum.

Fujitsu Microelectronics Europe (FME) has announced the MB86K23, a Mobile WiMAX baseband device targeting the expanding mobile PC market. MB86K23 is the next-generation of the successful MB86K21, which targeted embedded WiMAX in mobile PCs or in WiMAX PC cards and which has been certified by the WiMAX Forum.

The joint venture that united the wireless semiconductor division of STMicroelectronics and the mobile platform division of Ericsson will move forward as ST-Ericsson. This announcement follows the recent closing of the agreement announced in August 2008, between the parent companies, to merge Ericsson Mobile Platforms and ST-NXP Wireless.

The joint venture that united the wireless semiconductor division of STMicroelectronics and the mobile platform division of Ericsson will move forward as ST-Ericsson. This announcement follows the recent closing of the agreement announced in August 2008, between the parent companies, to merge Ericsson Mobile Platforms and ST-NXP Wireless.

Tensilica has announced the immediate availability of the Bluetooth sub-band codec (SBC) decoder and encoder for its popular HiFi 2 Audio DSP, which can easily be integrated into system-on-chip (SOC) designs. Now designers of cellular phones, portable music players and other devices can easily design in Bluetooth capabilities, along with over 50 other audio standards already available, that run on the HiFi 2 Audio DSP.

Tensilica has announced the immediate availability of the Bluetooth sub-band codec (SBC) decoder and encoder for its popular HiFi 2 Audio DSP, which can easily be integrated into system-on-chip (SOC) designs. Now designers of cellular phones, portable music players and other devices can easily design in Bluetooth capabilities, along with over 50 other audio standards already available, that run on the HiFi 2 Audio DSP.

ON Semiconductor has introduced the industry’s first integrated bi-directional device, with positive and negative (+/-) overvoltage protection (OVP) for cell phones, MP3/4, PDAs and GPS systems, and overcurrent protection (OCP) for portable accessories such as FM transceiver, loud speakers and flash modules.