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Casings & systems presented at Electronics & Automation 2015

7th May 2015
Barney Scott
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The POLYRACK TECH-GROUP will present its range of case and system solutions as well as panel PCs for HMI / MMI applications at the Electronics & Automation 2015 trade fair, 2nd to 4th June 2015 in Jaarbeurs Utrecht, Netherlands, at booth 8A027.

Besides various application-specific system solutions, one of the highlights at the trade fair booth is the case series SmarTEC, designed as passively cooled Mini-PC with x86-architecture. The SmarTEC product line is suitable as a platform for the realisation of high-quality systems thanks to its variable expandability. The two-part solution combines the accessibility from the top with the typical advantages of an extrusion solution, such as stability and design for quick assembly.

POLYRACK is presenting a heavy-duty, passively cooled case platform for harsh environmental conditions with its Rugged MIL ½ Short ATR Chassis. The case is designed for conformity with specifications in aerospace technology (MIL-Standard 810 and ARINC 40417). The ½ ATR Chassis can be configured using backplanes according to VITA in the bus structures VMEbus, VME64x, VPX or OpenVPX as well as backplanes according to PICMG in the structure types CPCI, CPCI Serial or CPCI Plus I/O. Power supply units and I/O-connection cards are further configuration elements of the ½ ATR Chassis.

POLYRACK will be demonstrating a wide variety of panel solutions for the embedded sector with the PanelPC 2 Series. The PanelPC 2 can be used for various applications, especially in industrial environments and over the extended temperature range of -20 to +85°C. The case construction is milled in aluminium, and available in sizes from 10.1 to 21.5“. A multi-touch capable PCAP touch screen can be used as UI. POLYRACK optionally offers tempered glasses and /or anti-fingerprint-coating.

Furthermore, POLYRACK will be showing its expanded Backplane portfolio in the high-speed sector with the standards VPX and CompactPCI Serial for data transfer rates from up to 10 Gbit/s. The extremely variable case series EmbedTEC comes in a variety of standard items and can be easily switched to a custom built. The flexible EmbedTEC offers a suitable base for different case applications in other fields of applications as well, even primarily developed for embedded computing and HMI applications

The POLYRACK Benelux S.P.R.L. supports customers in Belgium, Netherlands, Luxembourg as well as the Northern French departments from its location in Fernelmont, Belgium. The portfolio embraces integrated solutions for rack-mount or tabletop enclosures, Panel-PCs, Subracks and Backplanes up to microcomputer packaging systems as well as customer-specific solutions. The know-how of the companies POLYRACK Electronic-Aufbausysteme GmbH (Electronic Packaging), RAPP Kunststofftechnik GmbH (plastic injection moulding) and RAPP Oberflächenbearbeitung (surface finishing) GmbH is carrying and driving the already 35 year one-stop commitment to various markets.

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