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STMicroelectronics

  • 10 Maguire Road Bldg. 1, 3rd Floor Lexington, MA
    02421
    United States of America
  • 781-861-2650
  • http://www.st.com

STMicroelectronics Articles

Displaying 1341 - 1360 of 1490
Micros
2nd March 2009
STMicroelectronics Attacks New Markets for STM32 Family in Networked, Real-Time and Audio Applications

STMicroelectronics has added to its STM32 range, focusing on high-performance variants of industry-standard interfaces to allow more applications to benefit from the seamless pin-and-software compatibility between STM32 devices. The new STM32 Connectivity Line adds a Full-speed USB On-The-Go (OTG) interface, which allows end products to act as a USB Host or USB Device. There is also an Ethernet interface featuring hardware support for IEEE1588 Pr...

Pending
26th February 2009
STMicro Increases Power Output of Portable Stereo Amplifiers Featuring 3D Audio Capabilities

STMicroelectronics has introduced the TS4999, a two-channel, 2.8W class D stereo audio amplifier IC featuring 3D audio effects that improves sound quality from portable equipment. As end users demand progressively better audio experiences on the move, portable devices such as MP3 players, notebook computers, PDAs, and cellphones are being judged according to higher audio-quality metrics, such as stereo channel separation.

Analysis
25th February 2009
STMicroelectronics to promotes Green Power for Electronics in China

STMicroelectronics will demonstrate an array of energy efficiency products and solutions under the theme of ‘Green Power’ at IIC-China 2009 in Shenzhen, China, from February 26 to 27, 2009. More than 30 product demos showcase ST’s most advanced power management solutions which reflect ST’s commitment to help customers reduce their environment footprint.

Optoelectronics
20th February 2009
ST’s New Image Sensors Extend Depth of Field in Phone Cameras

STMicroelectronics has introduced a 1/4-inch optical format, 3-megapixel raw Bayer sensors with integrated Extended-Depth-of-Field (EDoF) capabilities. Enabling camera modules as small as 6.5 x 6.5mm, ST’s newest image sensors combine exceptional sharpness and user experience with size and cost benefits, offering a smart alternative to auto-focus camera solutions.

Optoelectronics
20th February 2009
ST’s New Image Sensors Extend Depth of Field in Phone Cameras

STMicroelectronics has introduced a 1/4-inch optical format, 3-megapixel raw Bayer sensors with integrated Extended-Depth-of-Field (EDoF) capabilities. Enabling camera modules as small as 6.5 x 6.5mm, ST’s newest image sensors combine exceptional sharpness and user experience with size and cost benefits, offering a smart alternative to auto-focus camera solutions.

Power
17th February 2009
STMicroelectronics’ MOSFET Technology Claims Industry’s Best On-Resistance per Area for Highest Efficiency and Power Density in 650V Rating

STMicroelectronics has announced a performance breakthrough for silicon power MOSFETs by achieving the best on-resistance per die area with its latest MDmesh V technology. MDmesh V will enable a new generation of 650V MOSFETs with RDS(ON) reaching below 0.079 Ohm in compact power packages to deliver industry-leading efficiency and power density. These devices target power-conversion systems where small size and low energy consumption are major go...

Wireless Microsite
12th February 2009
ST-Ericsson is new name for Wireless-Semiconductor Industry Leader

The joint venture that united the wireless semiconductor division of STMicroelectronics and the mobile platform division of Ericsson will move forward as ST-Ericsson. This announcement follows the recent closing of the agreement announced in August 2008, between the parent companies, to merge Ericsson Mobile Platforms and ST-NXP Wireless.

Wireless
12th February 2009
ST-Ericsson is new name for Wireless-Semiconductor Industry Leader

The joint venture that united the wireless semiconductor division of STMicroelectronics and the mobile platform division of Ericsson will move forward as ST-Ericsson. This announcement follows the recent closing of the agreement announced in August 2008, between the parent companies, to merge Ericsson Mobile Platforms and ST-NXP Wireless.

Communications
12th February 2009
Fast Broadband Amplifiers from STMicroelectronics

STMicroelectronics, a world leader in analog ICs, has introduced a new broadband signal amplifier IC that supports higher frequencies and faster response, as well as lower noise, than amplifiers used in current equipment.

Power
9th February 2009
Silicon Carbide Schottky Diodes from STMicroelectronics

Ordinary silicon diodes used in switched-mode power supplies lose up to 1% efficiency by not turning off immediately, but STMicroelectronics claims to be among the first companies to introduce silicon carbide (SiC) diodes that save this energy normally lost during switching.

Design
28th February 2008
STMicroelectronics Delivers Free TCP/IP Stack for STR91x Designers

STMicroelectronics has made the NicheLite TCP/IP stack available free of charge with its STR91x 32-bit Flash microcontrollers featured for networking applications, lowering cost-of-entry to that of open-source offerings but with the advantage of vendor support facilities. Compared to other third-party stacks, NicheLite is also royalty-free, helping manufacturers predict and manage their production costs.

Micros
26th February 2008
STMicroelectronics unveils 8-bit Microcontroller Platform

STMicroelectronics has unveiled details of a new 8-bit microcontroller platform designed to offer outstanding levels of performance and cost-effectiveness in a wide range of applications. Implemented around a high-performance 8-bit core and a state-of-the-art set of peripherals, the STM8 platform will be manufactured using an ST-proprietary 130nm embedded non-volatile memory technology.

Pending
21st February 2008
High Junction-Temperature TRIACs from STM Enable Smaller Heatsinks and Higher Power Density

STMicroelectronics has announced a new series of high-temperature TRIACs, which maintain full specified performance up to a junction temperature of 150 degrees C, and which deliver outstanding turn-off capability – ideal for appliance motor-control applications, in particular – at their maximum temperature. The high-junction-temperature TRIACs will enable manufacturers to lower their costs by using considerably smaller heatsinks, and also all...

Pending
20th February 2008
Power MOSFETs from STMicroelectronics Enable Higher Frequencies and Lower Losses in DC/DC Supplies

STMicroelectronics has announced two new Power MOSFETs, intended for the most demanding DC/DC converter applications, which use the latest version of ST’s proprietary STripFET technology to deliver extremely low conduction and switching losses, up to 3W lower in a typical voltage regulator module, and to achieve the lowest figure of merit – FOM = Rds(on) x Gate Charge (Qg) – among comparable competitive devices.

Pending
12th February 2008
Flip-Chip Stereo Headset Amplifier from STMicroelectronics Brings Premium Handhelds Closer to Audio Nirvana

STMicroelectronics has announced the TS4601, a stereo headset amplifier optimized for feature-phone applications that improves audio performance, extends battery life and enables more responsive user controls compared to existing solutions.

Wireless Microsite
11th February 2008
STM's Nomadik Application Processor Integrates Innovative Graphics Technology for Mobile Multimedia

STMicroelectronics today announced first results of its collaboration with AMD on next-generation graphics for mobile multimedia. ST’s newest mobile application processor, the Nomadik STn8820, integrates AMD’s innovative graphics technology to enable visually rich 2D and 3D applications on mobile handsets. Live demonstrations of ST’s Nomadik graphic capabilities will be presented at the Mobile World Congress 2008 in Barcelona.

Wireless
11th February 2008
STM's Nomadik Application Processor Integrates Innovative Graphics Technology for Mobile Multimedia

STMicroelectronics today announced first results of its collaboration with AMD on next-generation graphics for mobile multimedia. ST’s newest mobile application processor, the Nomadik STn8820, integrates AMD’s innovative graphics technology to enable visually rich 2D and 3D applications on mobile handsets. Live demonstrations of ST’s Nomadik graphic capabilities will be presented at the Mobile World Congress 2008 in Barcelona.

Wireless Microsite
8th February 2008
STMicroelectronics' Nomadik Chipset Boosts Multimedia Performance in Next-Generation Mobile Applications

STMicroelectronics has introduced a chipset that couples STs new multimedia application processor with a companion audio and power-management chip. This powerful platform raises the bar in mobile multimedia, enabling smart phones and other portable devices to record and share high-definition video clips, receive mobile TV, playback days of hi-fi music and deliver a state-of-the-art 3D gaming experience.

Wireless
8th February 2008
STMicroelectronics' Nomadik Chipset Boosts Multimedia Performance in Next-Generation Mobile Applications

STMicroelectronics has introduced a chipset that couples STs new multimedia application processor with a companion audio and power-management chip. This powerful platform raises the bar in mobile multimedia, enabling smart phones and other portable devices to record and share high-definition video clips, receive mobile TV, playback days of hi-fi music and deliver a state-of-the-art 3D gaming experience.

Wireless Microsite
8th February 2008
Mobile Phone Cameras Get Smaller and Smarter with New Imaging Single-Chip Sensor from STMicroelectronics

STMicroelectronics has introduced what it says is the market’s smallest single-chip camera sensor for mobile applications. Coupling low space requirements with advanced image processing capabilities, ST’s latest 2-megapixel mobile-phone camera sensor addresses consumers’ appetite for full-featured imaging solutions in ever-more popular thin-profiled handsets.

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