NXP Semiconductors announced the au10tic family of secure ICs designed specifically for device authentication. The au10tic secure microcontrollers are based on NXP's proven security technology, which has been widely used for securing government ID cards and passports, as well as smart cards for banking and other high-security applications. Offering easy integration into end devices, the NXP au10tic ICs provide a complete tamper-resistant securit...

With our long track record of RFID and security technology leadership, and our large internal manufacturing capability, NXP is well-placed to offer complete counterfeit protection.

NXP and Oberthur Technologies, announced today a licensing agreement for NXP’s MIFARE™ technology. This agreement enables Oberthur Technologies to integrate MIFARE™ into its SIM cards globally. This will further drive the adoption of NFC-enabled phones in infrastructures such as public transit, event ticketing, customer loyalty programs and access control around the globe.

NXP Semiconductors, your partner in Automotive Sensors (Angular sensors, Speed sensors)

NXP Semiconductors, your partner in Automotive Networking (FlexRay, CAN, LIN)

NXP Semiconductors, your partner in Automotive Telematics (Road pricing, eCall, ATOP, On Board Unit, OBU)

NXP Semiconductors, Leader in High Performance Mixed Signal solutions, experience NXP's Automotive capabilities

Atos Worldline, which brings together Atos Origin’s expertise in high-tech transactional services, and NXP Semiconductors today announced a unique end-to-end security and authentication solution designed to protect Smart Grid networks against energy theft, privacy breaches and grid attacks.

NXP Semiconductors N.V. today introduced the NXP Android application, allowing easy and fast access to NXP’s complete product portfolio. The free mobile application allows engineers to search, buy and share information on over 10,000 products from NXP’s High Performance Mixed Signal and Standard Products portfolio anytime, anywhere. This application will run on all Android smartphones and tablets supported by Android 1.6, 2.1, 2.2 and 2.3.

NXP Semiconductors today announced the release of the UJA107x family, its second generation of CAN/LIN System Basis Chips (SBCs) for in-vehicle networks. The UJA107x SBCs optimize the performance, power consumption and cost of electronic control units (ECUs) for a broad range of automotive applications, such as body control modules, climate control, seat control, electric power steering (EPS), adaptive lighting, rain/light sensors, parking assist...

NXP announced the release of the UJA107xA family, its next generation of CAN/LIN System Basis Chips (SBCs) for in-vehicle networks. Offering enhanced EMC (Electromagnetic Compatibility) performance, the chips meet the stringent requirements of global car OEMs such as Audi, BMW, Daimler, Ford, Porsche, Renault, Toyota and Volkswagen.

NXP Semiconductors N.V. today announced that it is developing a cutting-edge automotive-qualified 3.5G telematics solution to improve traffic management, which can help address the challenge of traffic congestion in Singapore. Expected to be deployed in 2012, NXP will develop innovative technologies based on NXP’s next-generation Automotive Telematics On-board Platform (ATOP). Singapore will be a test bed for ATOP, leveraging the city’s world...

This week sees the successful conclusion of a field trial designed to prove that the European emergency call system ‘eCall’ for vehicles is ready for mass deployment across Europe. The trial, which was initiated by NXP Semiconductors N.V., involved major industry players including BMW, IBM, Allianz OrtungsServices, Deutsche Telekom, Dekra, and European automobile clubs such as Touring, ANBW, AvD, and UAMK. Three cars equipped with NXP’s tel...

Today NXP Semiconductors announced the industry’s first RFCMOS-based, all-in-one digital chip for automotive radio applications. The TEF663x integrates AM/FM radio and audio signal post-processing functions in a single integrated circuit (IC). Until now, the tuner, radio DSP and audio post-processing DSP cores were separate ICs.

NXP today announced the appointment of two Radio Frequency Identification (RFID) industry veterans, further bolstering NXP’s RFID presence in North America. Victor Vega joins as the marketing director for RFID products and Suresh Palliparambil joins as the RFID Business Development Director. Both Victor and Suresh will be based in San Jose, California. Victor joins NXP with almost 17 years experience in RFID working previously with Motorola and...

NXP today announced the appointment of two Radio Frequency Identification (RFID) industry veterans, further bolstering NXP’s RFID presence in North America. Victor Vega joins as the marketing director for RFID products and Suresh Palliparambil joins as the RFID Business Development Director. Both Victor and Suresh will be based in San Jose, California. Victor joins NXP with almost 17 years experience in RFID working previously with Motorola and...

NXP announced that its CGV series of JESD204A-compliant data converters are now interoperable with Nujira’s OpenET envelope tracking (ET) and digital pre-distortion (DPD) solutions. Nujira is a leader in commercial-grade envelope tracking modulators for 3G and 4G wireless infrastructure applications, and is the founder of the OpenET Alliance.

NXP announced that Comba Telecom Systems Holdings Limited (Hong Kong stock code: 2342) has selected NXP high speed converters (HSC) for use in its digital repeater products. Comba, a leading wireless enhancement solutions provider, will be using NXP digital-to-analog converters (DAC) in the transmitter of its digital cellular repeaters.

NXP today announced the appointment of Jeff Palmer as Vice President, Investor Relations, reporting directly to Karl-Henrik Sundström, Executive Vice President and Chief Financial Officer. Palmer joins NXP having worked in the semiconductor and financial industry for over 25 years, most recently serving as Vice President, Investor Relations for Marvell Technology Group.

NXP Semiconductors (Nasdaq: NXPI) today announced the LPC11C22 and LPC11C24 – the industry’s first integrated high-speed CAN Physical Layer transceiver and microcontroller with easy-to-use on-chip CANopen drivers. Offered as a unique System-in-Package solution, the LPC11C22 and LPC11C24 with integrated TJF1051 CAN transceiver combine complete CAN functionality into a low-cost LQFP48 package.