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NXP Semiconductors Netherlands B.V.

NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 45,000 employees in more than 35 countries

NXP Semiconductors Netherlands B.V. Articles

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Latest
15th July 2021
Collaboration to extend connected vehicle insurance

NXP Semiconductors and MOTER Technologies have announced a secure data exchange platform that links deep data from connected vehicles to the insurance industry to power data science solutions for risk assessment, cost modeling, and more.

5G
30th June 2021
NXP brings GaN to 5G multi-chip modules

NXP Semiconductors has announced a milestone for 5G energy efficiency with the integration of Gallium Nitride (GaN) technology to its multi-chip module platform. Building on the company’s investment in its GaN fab in Arizona, NXP has announced RF solutions for 5G massive MIMO that combine the high efficiency of GaN with the compactness of multi-chip modules.

Wireless
28th June 2021
4 myths about UWB, debunked

Like any emerging technology, the myths around UWB hit the headlines almost as fast as the facts, and sometimes linger on in our memories. We asked several UWB ecosystem players to weigh in on the misconceptions they see attending UWB now and in the future as the technology becomes more accessible. Let’s demystify four misunderstandings about UWB. Guest blog written by Peter Pirc, UWB Solution Manager at NXP.

Communications
8th June 2021
Tools enable ultra-wideband applications for Apple

NXP Semiconductors has announced that it now offers beta Ultra-Wideband (UWB) development tools from its NXP Trimension portfolio that interoperate with the U1 chip in supported Apple products. The beta development tools will allow developers to kick-start the design of innovative applications that interact with UWB enabled Apple products including iPhone and Apple Watch, unleashing the ability to create more precise, directionally aware app expe...

Design
3rd June 2021
NXP launches processors on TSMC 16nm FinFET technology

NXP Semiconductors and TSMC has announced the release of NXP’s S32G2 vehicle network processors and the S32R294 radar processor into volume production on TSMC’s advanced 16 nanometer (nm) FinFET process technology.

Communications
3rd June 2021
Trimension ultra-wideband tech finds misplaced belongings

NXP Semiconductors announced that its Trimension Ultra-Wideband platform now offers fine ranging for new tagging use cases. UWB and Bluetooth Low Energy solutions have been combined to deliver spatial awareness to the new Samsung Galaxy SmartTag+, providing an enhanced experience to the Samsung SmartThings Find service.

IoT
29th April 2021
QFN solution to enable WiFi 6/6E in smartphones

OnePlus has selected NXP’s QFN RF Front End Solution for WiFi 6 for its latest high-end flagship smartphone, the OnePlus 9 featuring WiFi 6. NXP’s highly integrated QFN Front End Solution for WiFi 6/6E. The QFN solution supports the latest WiFi 6 wireless network standard and supports new 6GHz spectrum.

Blog
1st April 2021
The process of restarting a semiconductor facility

NXP is a member of the Austin, Texas community, and currently employs approximately 4,000 people and operating two wafer fabrication (fab) semiconductor facilities located at opposite ends of Austin: Oak Hill and ATMC. On February 15th, many of our operations team members braved heavy snow and dangerous driving conditions to make their way to the facilities, which run 24 hours a day, 7 days a week to keep the supply of products flowing. By Steve...

Communications
25th February 2021
CC-Link IE time-sensitive networking for automation

NXP has announced its integrated Time-Sensitive Networking (TSN) solutions for industrial automation that now support the CC-Link IE TSN protocol, combining gigabit Ethernet bandwidth with TSN to strengthen time sharing communication, performance, security and functionality for industrial Ethernet.

IoT
4th February 2021
EdgeLock 2GO IoT cloud platform for connected devices

NXP Semiconductors has introduced its new EdgeLock 2GO IoT service platform for easy, secure deployment and management of IoT devices and services. The new IoT security platform is integrated with NXP’s Common Criteria (CC) EAL 6+ certified EdgeLock SE050 secure element to protect IoT devices at the edge and securely connect them to one or multiple clouds and service providers.

Wireless
2nd February 2021
The era of the ‘Internet of Boxes’

The increasing strides made by technology are helping to advance our society in innumerable ways. Whether it is the tech being using at the coalface of vaccine development in the ongoing fight against the coronavirus pandemic, or the increasing drive towards autonomous vehicles within the automotive sector, technology is playing its part.

Communications
19th January 2021
6GHz spectrum unlocked with a WiFi 6E Tri-Band chipset

NXP Semiconductors has announced it is laying the foundation for a new era of WiFi 6 devices that can operate in the 6GHz band with its new CW641 WiFi 6E Tri-Band system-on-chip (SoC). With increasing congestion in the legacy 2.4GHz and 5GHz bands, the US FCC has approved 1.2GHz of unlicensed spectrum for the 6GHz band along with other regions around the world, which will transform the WiFi landscape.

Design
15th January 2021
BlueBox 3.0 for automotive high-performance computing

NXP Semiconductors has announced BlueBox 3.0, a new and expanded version of NXP’s safe Automotive High-Performance Compute (AHPC) development platform. Designed for software application development and validation ahead of silicon device availability, BlueBox 3.0 now offers a flexible way to address user-defined vehicles, safety Level 2+ (L2+) automated driving, and the evolving vehicle architectures that will revolutionise connected vehicle...

Wireless
6th January 2021
COVID-19 sparks a rise in biometric contactless payment

The COVID-19 pandemic has had ramifications everywhere, for almost – if not all – the industries in the world. Contactless payment existed before coronavirus hit, but it worked alongside cash and chip-and-pin. However, the pandemic has seen a considerable increase in the amount of transactions using contactless payment. Because of this, biometric payment cards – significantly more secure than standard contactless cards – a...

Sensors
16th December 2020
Suite of radar sensor solutions create a safety cocoon

NXP Semiconductors has announced a complete suite of new radar sensor solutions that can surround vehicles in a 360-degree safety cocoon and enable the identification and classification capabilities of imaging radar.

Artificial Intelligence
15th December 2020
To get a handle on ethical AI, we must first secure the Edge

With the advancement of technology, Artificial Intelligence (AI) has started to become a tangible part of our everyday lives, assisting us with transportation, healthcare, protecting the environment and even helping us at home. In the coming decades, AI applications will go much further. Guest blog written by Lars Reger, NXP Semiconductors

IoT
24th November 2020
Xiaomi PonPon Tile 2.0 stickers connect the smart home

NXP Semiconductors and Xiaomi have announced the new Xiaomi PonPon Tile 2.0 stickers, powered by NXP’s NTAG NFC chip technology. The PonPon stickers and Xiaomi’s Mijia (Mi Home) app work with a multitude of Xiaomi Mi smart home devices, such as lighting, security cameras, alarm clocks and entertainment systems. Configuring and managing the devices is all done with a simple tap of a Xiaomi NFC-enabled smartphone.

Automotive
20th November 2020
NXP and AWS collaborate for connected vehicles

NXP Semiconductors has announced a strategic relationship with Amazon Web Services (AWS) focused on extending the opportunities of connected vehicles. The collaboration aims to deliver a secure, edge-to-cloud compute solution for next-generation vehicles that can enable new cloud-powered services to benefit carmakers, their business partners and consumers alike.

Micros
20th November 2020
LPC55S16 MCU awarded Level 2 certifications

NXP Semiconductors has announced the LPC55S16 MCU has been awarded Level 2 certifications by both the PSA Certified scheme co-developed by Arm and the GlobalPlatform Security Evaluation Standard for IoT Platforms (SESIP) using the secure protection profile for embedded processors. With fast-expanding IoT and Industrial edge applications, device security and data protection become paramount.

Micros
17th November 2020
New S32K3 MCUs for automotive software development

NXP Semiconductors has announced the S32K3 microcontroller (MCU) family, the newest addition to its S32K product line. The S32K1 family, released in 2017, marked an important turning point in addressing software’s central role in automotive development. 

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