Microsemi has today revealed the availability of three more devices in its new generation of 1200 volt non-punch through IGBTs: the APT85GR120B2, APT85GR120L and APT85GR120J. All of the devices in this product family are based on Microsemi’s advanced Power MOS 8 technology, which enables a significant reduction of at least 20 percent in total switching and conduction losses as compared to competitive solutions.

Microsemi today announced a new die packaging technology has passed an internal qualification regime typical for active implantable medical devices consisting of thermal and mechanical stressing to MIL-STD-883 test standards. The die packaging technology is targeted at implantable medical devices such as pacemakers and cardiac defibrillators. It can also be used in wearable devices such hearing aids and intelligent patches, as well as nerve stimu...

Microsemi today announced it has achieved National Institute of Standards and Technology certification for the advanced encryption standard algorithm on its ultra-secure TRRUST-Stor solid state drive designed for critical data storage. TRRUST-Stor is one of the few solid state drives on the market that has hardware-implemented AES encryption with a 256-bit key using the XTS block cipher mode.

Microsemi has today revealed its 1011GN-700ELM, the first in a family of radio frequency transistors for high-power air traffic control, secondary surveillance radio applications. SSR is used to send a message to an aircraft equipped with a radar transponder and collect information that allows air traffic controllers to identify, track and measure the location of that particular aeroplane.

Microsemi has today revealed that a new die packaging technology has passed an internal qualification regime typical for active implantable medical devices consisting of thermal and mechanical stressing to MIL-STD-883 test standards. The die packaging technology is targeted at implantable medical devices such as pacemakers and cardiac defibrillators.

Microsemi has today extended its congratulations to NASA and the Jet Propulsion Lab for the historic landing of the Mars Curiosity rover. Several of Microsemi's space products were used in mission critical applications during the launch and flight to Mars, and continue to support the mission on the surface of Mars.

Microsemi declared today the availability of new advanced motor control algorithms optimized for its SmartFusionR customizable system-on-chip, allowing design engineers to realize highly reliable multi-motor control in a single IC and reducing system cost and power.

Microsemi Corporation today announced that its field programmable gate arrays and SmartFusion customizable system-on-chip solutions are now characterized at extreme operating temperatures ranging from 150 degrees Celsius to 200 degrees Celsius.

Microsemi Corporation today strengthened its RF power product line with the introduction of the DRF1400 power MOSFET. It is well-suited for use in RF generators for a wide range of industrial, scientific and medical applications including plasma generation for semiconductors, LCD and solar cell manufacturing, and CO2 lasers operating up to 30 megahertz.

Microsemi Corporation today introduced the first in a series of new generation 1200 volt (V) non-punch through (NPT) IGBTs. The new family of IGBTs leverages Microsemi's leading-edge Power MOS 8 technology, and offers a dramatic reduction of 20 percent or more in total switching and conduction losses as compared to competitive solutions.

Microsemi Corporation today unveiled a new dimmable LED driver module optimized for worldwide residential, commercial and industrial light fixtures. The 30 watt (W) LXMG221W-0700030-D0 LED driver enables start up times of 150 milliseconds (ms) or faster, closely emulating the “lights-on” performance of a typical incandescent lamp. This is important for home and business applications where light start-up delays are unacceptable. Micros...

Microsemi Corporation today introduced a suite of system and power management design tools for high availability wired and wireless communications infrastructure equipment. The new design tools include Microsemi’s Mixed Signal Power Manager (MPM) 4.0 reference design, which supports up to 64 power rails and mixed analogue and digital point-of-loads (POLs), as well as PMBus-based communication.

Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it has shipped its 10,000th radiation-tolerant RTAX-S FPGA device for flight-critical applications. Microsemi has also shipped tens of thousands of its previous generation spaceflight FPGAs.

Microsemi Corporation today announced its SmartFusion customizable system-on-chip (cSoC) devices are now fully screened to meet stringent military operating temperatures ranging from -55 degrees C to 125 degrees C. The devices feature an integrated ARM Cortex-M3-based processor and are fully tested for operation at military temperature ranges, targeting applications where ensuring high-reliability performance is critical.

Microsemi Corporation today announced the availability of an LCD display reference design for industrial and medical applications based on the company’s SmartFusion customizable system-on-chip (cSoC). The flexible cSoC architecture allows product developers to support a wide variety of LCD panel configurability options, as well as the ability to change LCD driver functionality to support product upgrades on a cost-effective, remote basis. I...

Microsemi Corporation today expanded the industry’s largest synchronous Ethernet (SynchE) product portfolio with the single-chip, ZL30150 line card device for mobile multimedia and packet-based carrier Ethernet applications. Microsemi’s ZL30150 features two integrated digital phase lock loops (DPLLs) that can lock on to up to four inputs for applications that require independent transmit and receive timing paths.

Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced a new, revolutionary non-dissipative LED backlight driver for LCD TV applications. The LX27901 features a proprietary non-dissipative architecture that dramatically increases power efficiency while enhancing backlight performance and lowering total solution cost. It is also the first d...

Microsemi Corporation today announced its participation in a multi-disciplinary consortium funded by the European Union (Seventh Framework Programme, FP7) tasked with developing standardized Electro Mechanical Actuators (EMA) for aerospace applications to eliminate hydraulic circuits, pumps and reservoirs.

Microsemi Corporation today announced that its radiation tolerant RT ProASIC 3 family of field programmable gate arrays (FPGAs) is now available in a ceramic quad flat pack (CQFP) package. CQFP packages comply with time-tested and flight-proven circuit board and assembly techniques. In addition, ceramic withstands extreme operating temperatures, which makes it an ideal material for demanding space applications.

Microsemi Corporation today announced its participation in a multi-disciplinary consortium tasked with developing innovative CMOS-compatible, high-temperature sensors that help reduce carbon emissions and drive energy consumption savings. The European Union’s Seventh Framework Programme (FP7ICT) is funding the majority of the SOI-HITS (Silicon on Insulator High Temperature Systems) project, which is slated for completion by the end of August 20...