Infineon launched its new AUDO MAX family of 32-bit microcontrollers (MCUs) for automotive powertrain and chassis applications. The AUDO MAX family supports design of engine management systems meeting the strict Euro 5 and Euro 6 emission standards for combustion vehicles and enables the electrification of powertrain functions in electrical vehicles. Key features of the AUDO MAX family are maximum clock frequencies of up to 300MHz, high-speed in...

Infineon Technologies announced its new SLI 76 “in Car” family of microcontrollers for the use in automotive Machine-to-Machine (M2M) systems. They are the industry’s first UICC (Universal Integrated Circuit Card) microcontrollers that are qualified by the stringent processes of the Automotive Electronics Council (AEC) Q100 quality standard. The SLI 76 “in Car” chips offer long lifetime, high data retention, extended temperature range, ...

Six partners from the semiconductor and solar industries are joining forces in the NEULAND project funded by the Federal Ministry of Education and Research (BMBF) to explore new avenues for the efficient use of electricity from renewable sources. NEULAND stands for innovative power devices with high energy efficiency and cost effectiveness based on wide bandgap compound semiconductors. The project aims to reduce the losses in feeding electricit...

Infineon is supplying its next generation of security controllers of the SLE 78 product family for the new German ID card. The German authorities have been issuing the new electronic ID in chip card format since November 1, 2010. Infineon is providing a significant share of the chips for Europe’s biggest ID project. Currently, around 60 million German ID cards are in circulation, usually valid for ten years. About 6.5 million ID cards are issue...

Infineon today at the “Cartes & Identification” Trade Show in Paris announced the introduction of 90nm SOLID FLASH™ technology for its new generation of security ICs. With SOLID FLASH, Infineon is the worldwide first supplier of security products combining the advantages of highly flexible and reliable Flash with outstanding and secure contactless performance, targeting applications like payment, government ID, high-end mobile communicatio...

Infineon Technologies announced its new SLI 76 “in Car” family of microcontrollers for the use in automotive Machine-to-Machine (M2M) systems. They are the industry’s first UICC (Universal Integrated Circuit Card) microcontrollers that are qualified by the stringent processes of the Automotive Electronics Council (AEC) Q100 quality standard. The SLI 76 “in Car” chips offer long lifetime, high data retention, extended temperature range, ...

Infineon Technologies and Xinjiang Goldwind Science and Technology Co., Ltd., the Chinese leader in R&D and manufacturing of wind power equipments, today signed a license agreement for core components needed in manufacturing of wind turbines. According to the agreement, Goldwind gains the license to produce Infineon IGBT (Insulated Gate Bipolar Transistor) stacks used in converters of MW (Megawatt)-grade wind turbines. Furthermore, Infineon will...

Infineon Technologies announced the release of a design evaluation kit for development of communication systems supporting the IO-Link V1.1 standard, using the company’s 16-bit XE166 and 8-bit XC800 microcontrollers. The industry first solution leverages the real-time performance of the XE166 MCU and the cost-effective XC800 device for system designs that support up to eight IO-Link channels on the master with a FIFO buffer for each channel. D...

Infineon Technologies has won the Bavarian State Award for Electric Mobility. Martin Zeil, Bavarian Minister of Economics, Infrastructure, Transport and Technology, presented the award to Peter Bauer, CEO of Infineon Technologies AG, yesterday evening. The ceremony at which the awards were conferred in altogether seven categories was held alongside the eCarTec International Trade Fair for Electric Mobility in Munich. The award went to Infineon in...

Three German partners from industry and research are joining forces in a quest to curb one of the worst energy guzzlers in the household and to introduce energy efficiency to the kitchen. Use of the induction cooking method – where only pots and pans are heated and not the stovetop – could save up to 25 percent electricity. Today, about ten to 15 percent of German households are equipped with an induction cooker. The initial price difference ...

Infineon Technologies AG and Intel Corporation have entered into a definitive agreement to transfer Infineon’s Wireless Solutions (WLS) business to Intel in a cash transaction valued at approximately US Dollar 1.4 billion. WLS, a leading provider of cellular platforms to top tier global phone makers, will operate as a standalone business serving its existing customers. WLS will also contribute to Intel’s strategy to make connected computing u...

In a joint effort to secure the future of Altis Semiconductor and its employees, IBM (NYSE:IBM) and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today closed a transaction to sell 100% of the share capital of Altis Semiconductor to the new corporation Altis International. IBM and Infineon said this completes the divestment of their joint venture Altis Semiconductor in France.

Peter Bauer, former Spokesperson of the Management Board, has been appointed Chairman of the Board with immediate effect. Chief Financial Officer and Labor Director Dr. Marco Schröter has left the Management Board of Infineon Technologies AG with immediate effect. This was caused by differences in opinion over future company policy.

Infineon Technologies AG is in discussions with interested parties about a transaction concerning Infineon’s segment Wireless Solutions (WLS). A significant progress has been made within these discussions. The objective of a potential transaction is the strategic development of the segment Wireless Solutions (WLS). With an annual revenue of Euro 917 million, WLS has contributed approx. 30 per cent to Infineon Technologies AG’s total annual r...

The biggest research project in Europe to research and develop highly integrated electronic system-in-package solutions has been launched. Working together on the ESiP project (Efficient Silicon Multi-Chip System-in-Package Integration) are 40 microelectronics companies and research institutions from a total of nine European countries, with the aim of making miniaturized complex microelectronics systems more reliable and testable. Under the leade...

Infineon launched its new AUDO MAX family of 32-bit microcontrollers (MCUs) for automotive powertrain and chassis applications. The AUDO MAX family supports design of engine management systems meeting the strict Euro 5 and Euro 6 emission standards for combustion vehicles and enables the electrification of powertrain functions in electrical vehicles. Key features of the AUDO MAX family are maximum clock frequencies of up to 300MHz, high-speed in...

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced a 30V Power MOSFET (Metal Oxide Semiconductor Field Effect Transistor) with the world’s lowest R DS(on) for high current automotive applications. The new OptiMOS™-T2 30V MOSFET is a N-channel device with drain current of 180A and R DS(on) of just 0.9mΩ at 10V gate-to-source voltage. The IPB180N03S4L-H0, which comes in a D2PAK-7 package, addresses customer needs for Powe...

Infineon introduced an enhanced family of three wireless control receivers offering highest available sensitivity and low power consumption. The TDA5240, TDA5235 and TDA5225 devices provide multi-band support (315MHz, 434MHz, 868MHz and 915MHz) for worldwide coverage and are well-suited for use in various automotive applications, including Remote Keyless Entry (RKE) systems, Tire Pressure Monitoring Systems (TPMS), remote start, control, status ...

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that it has settled its patent infringement claim against Elpida Memory Inc., and both Infineon and Elpida have agreed to seek dismissal of all pending patent infringement cases. Infineon initiated proceedings in February 2010, when it filed a complaint against Elpida and Elpida’s customers in the U.S. International Trade Commission (ITC). Elpida subsequently filed two lawsuits ...

Infineon Technologies and Fairchild Semiconductor today announced a packaging partnership for their power MOSFETs in the Infineon PowerStage 3x3 or Fairchild MLP 3x3 (Power33™) packages.