Eduardo Morral, Product Marketing Manager M2M, Infineon Technologies, highlights how high quality eSIM controllers are becoming integral for industrial automation environments and connected cars.

Preparing for smart lighting, Infineon introduces the XDPL8220 LED driver IC. Primary side control saves extra components, says the company, reducing cost while increasing reliability.

Passengers taking the Pierce County Ferry in Washington State are not only traversing the lower Puget Sound conveniently, they are also the first in the U.S. to enjoy fully electronic ticketing based on the CIPURSE open standard for electronic fare collection. The operator, HMS Ferries, now enables customers to purchase QR-code tickets on their smartphones, online or at the ticket booth at the Steilacoom Terminal, which speeds up the bo...

Based on super junction technology, the CoolMOS P7 series of 800V MOSFETs can be used for low power SMPS applications, focusing on flyback topologies typically found in applications like adapter, LED lighting, audio, industrial and auxiliary power.

Users of public transport in Taiwan now have a new range of secured iPASS-ready wearables at hand: Infineon Technologies, one of the world’s largest suppliers of security chips, provides its unique Boosted NFC secure element solutions for wearables performing secured transactions such as transport ticketing and micropayment.

Infineon Technologies AG and Mocana Corporation take IoT security to the next level. Embedded systems security specialist Mocana integrates support for the Infineon OPTIGA TPM (Trusted Platform Module) security controller as a standard feature into its latest Security of Things Platform.

The Infineon Security Partner Network (ISPN) welcomes new partners with the addition of ESCRYPT Embedded Security and GlobalSign, who both offer dedicated security solutions for Industry 4.0 applications based on OPTIGA Trusted Platform Modules (TPMs). The ISPN is a network of leading security players who offer hardware-based security to IoT device manufacturers and service providers.

NFCRing has introduced the world's first EMVCo compliant payment ring based on a contactless security chip from Infineon Technologies. The tiny, water-proof smart wearable works like a contactless payment card. Users can pay by simply holding their finger with the ring closely to any EMVCo contactless-enabled payment terminal. The ring uses NFC technology to communicate data over short distances of a few centimetres.

Strengthening airport access control systems for its personnel, Korea Airports Corporation (KAC) has implemented a new security solution based on the CIPURSE security standard. Infineon Technologies supplies the security chips for the electronic access control cards handed out to the staff at three of the 14 Korean civil aviation airports managed by KAC. Additional airports are to follow successively.

All around the world, airports and aviation buildings are some of the most protected public environments. To further strengthen airport access control systems for its personnel, Korea Airports Corporation (KAC) has been implementing a new solution based on the CIPURSE security standard. Infineon supplies the security chips for the electronic access control cards handed out to the staff.

A family of Hall sensors introduced by Infineon Technologies enable automotive, industrial and consumer electronics to meet strict environmental standards. They will also help fulfil the requirements of very cost-effective and compact designs. Available as latch and switch-type sensors, the TLx496x family Hall sensors are highly integrated, have precise switching points, a stable operation and a low power consumption.

With the introduction of a 50mm module, Infineon Technologies AG extends its product portfolio of thyristor/diode modules in solder bond technology. These bipolar modules address the growing market for cost-effective solutions even in demanding applications. Depending on the module, market prices are approximately 25% lower than comparable pressure contact variants. 

Infineon has entered into a definitive agreement to acquire the Wolfspeed Power and RF division (“Wolfspeed”) of Cree. The deal also includes the related SiC wafer substrate business for power and RF power. The purchase price for this planned all-cash transaction is $850m (approximately €740m). This acquisition will enable Infineon to provide the broadest offering in compound semiconductors and will further strengthen Infineon as...

Infineon Technologies takes an active role in the development of European-level cybersecurity guidelines. The European Commission has signed the contract for a Public-Private-Partnership (PPP) with the European Cyber Security Organisation (ECSO) ASBL. Representing the private sector, ECSO will work directly with the European Commission to improve Europe’s industrial policy on cybersecurity.

  Expanding the company's product offering for SMPS applications, Infineon announces the  IR1161L and IR11688S Secondary Synchronous Rectification (SSR) controller ICs.

Online applications on mobile devices require new methods of secured log-in. The FIDO (Fast IDentity Online) Alliance has developed security standards for strong authentication that are simple to use and protect more efficiently from fraud. Infineon Technologies has announced the first FIDO-certified BLE reference design for wireless authentication tokens.

By the end of 2016, more than half of all new automotive 77GHz radar systems worldwide will be equipped with chips from Infineon Technologies. Statistically speaking, that means around one in 15 new cars will use a driver assistance system with 77GHz radar chips from Infineon.

Lenovo is the first manufacturer worldwide to bring Tango technology to a consumer product. Google's technology that allows devices to understand spatial information is an exclusive feature in the PHAB2 Pro smartphone launched today. Based on the Time-of-Flight principle, the REAL3 image sensor chip from Infineon equips the smartphone with a 3-dimensional perception of the surroundings in real-time.

The research project SemI40 (“Power Semiconductor and Electronics Manufacturing 4.0”) led by Infineon Austria was launched recently. In this project 37 partners from five countries will carry out research into further developing autonomous factories. The common goal is the next stage in the development of  Industry 4.0 applications. With a volume of €62m, the research project is one of the largest Industry 4.0 projects in Eu...

Unveiled at the annual Imec Technology Forum in Brussels (ITF Brussels 2016), imec and Infineon Technologies are cooperating in CMOS sensor chip development. The two companies are working on highly integrated CMOS-based 79GHz sensor chips for automotive radar applications with imec's contribution of its advanced expertise in high-frequency system, circuit and antenna design for radar applications complementing Infineon’s radar sensor chip k...