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Design
15th July 2021
Ultra-rugged Intel Core modules with soldered RAM

congatec has introduced new 11th Gen Intel Core processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40 to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications.

Boards/Backplanes
9th June 2021
Fast track to NPU accelerated embedded vision

congatec has extended its i.MX 8 ecosystem with a new starter set for AI accelerated intelligent embedded vision applications. Based on a SMARC Computer-on-Module with i.MX 8M Plus processor, the starter set’s sweet spot is the utilisation of the new processor integrated NXP Neural Processing Unit (NPU).

Latest
26th May 2021
congatec to expand its business in Korea

congatec has announced the foundation of congatec Korea to meet increasing customer demand in South Korea. The establishment of a new subsidiary underlines the importance of Korea for congatec’s global business success.

Artificial Intelligence
17th May 2021
AI to make healthcare smarter at CMEF

The congatec CMEF showcase put the spotlight on the latest embedded computing and artificial intelligence (AI) technologies for medical imaging and diagnostics, operating theaters as well as mobile emergency and intensive care equipment.

Boards/Backplanes
17th March 2021
SMARC 2.1 modules with NXP i.MX 8M Plus processor

congatec has presented a low power SMARC 2.1 Computer-on-Modules with NXP i.MX 8M Plus processor for industrial edge analytics, embedded vision and artificial intelligence (AI) at embedded world 2021 DIGITAL.

Boards/Backplanes
15th March 2021
COM-HPC starter set with 11th Gen Intel Core processors

congatec has introduced a brand new COM-HPC starter set. Optimised for modular system designs utilising the latest high-speed interface technologies such as PCIe Gen4, USB 4.0 and up to ultra fast 2x25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel Core processor technology (code name Tiger Lake).

Design
5th March 2021
Doubled performance with Ryzen Embedded V2000 processor

congatec has introduced the conga-TCV2, a COM Express Compact Computer-on-Module based on AMD Ryzen Embedded V2000 processors. With double the performance compared to the earlier launched AMD Ryzen Embedded V1000, the module has good performance per watt, and finds its sweetest spot in 15W TDP designs.

Boards/Backplanes
5th March 2021
SMARC 2.1 modules with NXP i.MX 8M Plus processor

congatec has presented its new low power SMARC 2.1 Computer-on-Modules with NXP i.MX 8M Plus processor for industrial edge analytics, embedded vision and artificial intelligence (AI) at embedded world 2021 DIGITAL.

Boards/Backplanes
5th March 2021
New COM-HPC starter set at embedded world

congatec has presented a new COM-HPC starter set at embedded world 2021 DIGITAL. Optimised for modular system designs utilising the latest high-speed interface technologies such as PCIe Gen4, USB 4.0 and up to ultra fast 2x25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel Core processor technology (cod...

Boards/Backplanes
19th February 2021
Extended temperature range platforms for edge computing

congatec has focused on customers’ ruggedisation challenges for virtual embedded world 2021, and will be presenting extended temperature range platforms for all performance levels, from high-end COM-HPC to low power SMARC modules. 

Industrial
5th February 2021
Eight cores for heterogeneous edge computing

Tasks at the embedded edge are getting more and more complex. Supporting up to eight cores and 16 threads, the recently launched AMD Ryzen Embedded V2000 processors are hoping to pave the way for x86-based embedded designs with high compute density and performance per watt.

Boards/Backplanes
17th November 2020
congatec introduces new ecosystem for COM-HPC

congatec has introduced the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are a major milestone for the COM-HPC integration and have been created to accelerate the utilisation of congatec’s COM-HPC modules based on the latest 11th Gen Intel Core processors (code name Tiger Lake).

Boards/Backplanes
17th November 2020
AMD Ryzen Embedded V2000 processor on COM Express Compact

congatec has broadened the application areas of its AMD Ryzen Embedded processor based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched today on the COM Express Compact footprint.

Boards/Backplanes
16th November 2020
New platforms for tactile internet applications

congatec has introduced new application-ready platforms for tactile internet applications over public broadband as well as private IP networks. They support Time Sensitive Networking (TSN) in combination with the new Intel Time Coordinated Computing (Intel TCC) technology, which complements the TSN Ethernet standard based on latest Intel IP technology.

Design
13th November 2020
Computer-on-Modules to withstand extreme temperatures

congatec has introduced six new Computer-on-Modules with 11th Gen Intel Core processors for the extended temperature range. Built with high-quality components designed to withstand extreme temperatures from -40 to +85°C, the new COM-HPC and COM Express Type 6 Computer-on-Modules provide all features and services required for reliable operation in the most challenging environments.

Design
12th November 2020
Solution platform offering to rugged fog computing market

congatec has announced that it is expanding its embedded and edge computing solution platform offering to include the new market of rugged fog computer technologies. Used in various industrial as well as critical network applications, rugged fog computers reside in the network computing and communication pyramid above the edge device layer.

Design
12th November 2020
AMD Ryzen embedded V2000 processor on COM Express Compact

congatec has significantly broadened the application areas of its AMD Ryzen Embedded processor based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched on the COM Express Compact footprint.

Boards/Backplanes
12th October 2020
congatec Computer-on-Modules with Intel Core processors

congatec has announced the launch of 12 brand new Computer-on-Modules in parallel with the Intel IOTG (Internet of Things Group) launch of the 11th Gen Intel Core processors. Based on the new low-power high-density Tiger Lake SoCs the new modules offer greater CPU performance and higher GPU performance along with PCIe Gen4 and USB4 support.

Design
4th September 2020
First COM-HPC and next-gen COM Express

In parallel with the 11th Gen Intel Core processor launch (code named “Tiger Lake”), congatec has announced the availability of both its first COM-HPC Client size A module and a next generation COM Express Compact Computer-on-Module. This provides engineers the choice to further scale the performance of their existing systems or develop the next generation of products utilising COM-HPC’s broader array of interfaces.

Latest
24th August 2020
DBAG invests in congatec to accelerate edge computing

The Deutsche Beteiligungs AG (DBAG) is investing in congatec. Today, with more than two-thirds of congatec's revenue coming from customers based in Europe, congatec expects to see its share of sales with customers in the USA and Asia growing rapidly, and also expects this trend to accelerate.

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