congatec Articles

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News & Analysis
15th March 2023
Building a high-performance ecosystem for Arm based SMARC modules

Congatec, a vendor of embedded and edge computing technology, is pleased to announce that it is expanding its strategic solutions portfolio in the Arm processor sector to include Texas Instruments (TI) processors.

News & Analysis
8th March 2023
Joint COM-HPC evaluation carrier board standardisation agreement

The two German embedded and edge computing heavyweights, congatec and Kontron, have concluded a cooperation agreement to standardise the design schematics of COM-HPC evaluation carrier boards from both companies, and to publish most of these schematics in public design guides.

28th February 2023
congatec introduces a new carrier board design training program

congatec announced the launch of a new carrier board design training program to impart best practice knowledge on how to design-in leading Computer-on-Module standards COM-HPC and SMARC.

9th February 2023
congatec small form factor to complete high-performance ecosystem

congatec will be presenting its comprehensive COM-HPC ecosystem at embedded world 2023 (hall 3/booth 241). The portfolio now ranges from high-performance COM-HPC Server-on-Modules to ultra-compact and brand-new COM-HPC Client-on-Modules that is hardly larger than a credit card.

19th January 2023
The performance boost consolidated edge applications have been waiting for

Congatec announces the availability of new COM-HPC Client Computer-on-Modules based on high-end processor variants of the 13th Gen Intel Core processors. The launch expands the already available portfolio of high-performance COM-HPC modules with soldered processors to include the even more powerful socketed variants of this processor generation. The new conga-HPC/cRLS Computer-on-Modules in COM-HPC Size C form factor (120x160mm) address applicati...

3rd January 2023
A happy new year for high-end embedded computers

congatec, a specialist vendor of embedded and edge computing technology, announces the availability of COM-HPC and COM Express Computer-on-Modules based on high-end 13th Gen Intel Core processors in BGA assembly.

13th December 2022
Mini form factor for maximum performance

congatec is pleased to announce that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the new credit-card-sized (95 x 60mm) Computer-on-Module specification COM-HPC Mini. The COM-HPC Mini standard is now entering the home stretch towards final ratification, which is scheduled for the first half of 2023.

1st December 2022
congatec welcomes COM Express 3.1 specification

congatec, a vendor of embedded and edge computing technology, welcomed the ratification of the COM Express 3.1 standard with the launch of 10 compliant Computer-on-Modules based on 12th Gen Intel Core processors (formerly codenamed Alder Lake).

18th November 2022
congatec introduces new ecosystem for TSN

congatec, a vendor of embedded and edge computing technology, has introduced its new ecosystem for TSN aimed at networked factories and critical infrastructures.

26th July 2022
congatec introduces COM-HPC carrier board

congatec has introduced its first modular Micro-ATX compliant carrier board with COM-HPC interface.

12th July 2022
Making the robotic edge modular

Intel Labs China has chosen congatec COM Express modules for easy and efficient design-in and flexible processor scalability in its Heterogeneous Extensible Robot Open (HERO) platform.

28th June 2022
Variants of 12th Gen Intel Core IOTG mobile processors

congatec, a leading vendor of embedded and edge computing technology, has introduced seven less power-hungry variants of the 12th Generation Intel Core IOTG (Intel's Internet of Things Group) mobile processors (formerly codenamed Alder Lake) on seven new COM-HPC and COM Express computer-on-modules.

27th June 2022
congatec takes first step into functional safety market

congatec announced massive investments in functional safety (FuSa) at embedded world 2022 in Nuremberg.

27th June 2022
Duo collaborate to solve medical design challenges

At embedded world 2022 in Nuremberg congatec and System Industrie Electronics (SIE) launched their new co-creation services for the design of IT/ OT systems dedicated for the medical and healthcare sector.

17th May 2022
congatec simplifies Arm deployments with i.MX 8M Plus

congatec announces that its SMARC Computer-on-Modules based on NXP i.MX8 M Plus processor technology have achieved SystemReady IR certification within the Arm driven Cassini project.

29th March 2022
Intertraffic Amsterdam: congatec

congatec, a vendor of embedded and edge computing technology – is pleased to introduce new rugged vehicle computing platforms for smart mobility applications in the extended temperature range at Intertraffic Amsterdam, Hall 5/Booth 309.

25th February 2022
World premiere for x86 based COM-HPC Server

congatec, a vendor of embedded and edge computing technology, celebrates the world premiere for x86 based COM-HPC Server modules by announcing the availability of three new Server-on-Module families parallel to the launch of the brand-new Intel Xeon D processor family, formerly codenamed Ice Lake D.

10th February 2022
Congatec simplifies COM-HPC designs

Congatec a vendor of embedded and edge computing technology – welcomes the publication of the COM-HPC Carrier Board Design Guide by the PCI Industrial Computer Manufacturers Group (PICMG) with the launch of a fully specification compliant ecosystem for engineers of COM-HPC Client and Server module based designs. 

5th January 2022
A quantum leap in core count

congatec – a vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. 

1st December 2021
Round-the-clock accessibility provided by congatec

congatec has opened a digital trade show booth as a permanent exhibition on their website, providing additional learning opportunities for potential customers who are unable to attend trade fairs and exhibitions due to the pandemic, 

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