Ultra-rugged Intel Core modules with soldered RAM
congatec has introduced new 11th Gen Intel Core processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40 to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications.
Fast track to NPU accelerated embedded vision
congatec has extended its i.MX 8 ecosystem with a new starter set for AI accelerated intelligent embedded vision applications. Based on a SMARC Computer-on-Module with i.MX 8M Plus processor, the starter set’s sweet spot is the utilisation of the new processor integrated NXP Neural Processing Unit (NPU).
congatec to expand its business in Korea
congatec has announced the foundation of congatec Korea to meet increasing customer demand in South Korea. The establishment of a new subsidiary underlines the importance of Korea for congatec’s global business success.
AI to make healthcare smarter at CMEF
The congatec CMEF showcase put the spotlight on the latest embedded computing and artificial intelligence (AI) technologies for medical imaging and diagnostics, operating theaters as well as mobile emergency and intensive care equipment.
SMARC 2.1 modules with NXP i.MX 8M Plus processor
congatec has presented a low power SMARC 2.1 Computer-on-Modules with NXP i.MX 8M Plus processor for industrial edge analytics, embedded vision and artificial intelligence (AI) at embedded world 2021 DIGITAL.
COM-HPC starter set with 11th Gen Intel Core processors
congatec has introduced a brand new COM-HPC starter set. Optimised for modular system designs utilising the latest high-speed interface technologies such as PCIe Gen4, USB 4.0 and up to ultra fast 2x25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel Core processor technology (code name Tiger Lake).
Doubled performance with Ryzen Embedded V2000 processor
congatec has introduced the conga-TCV2, a COM Express Compact Computer-on-Module based on AMD Ryzen Embedded V2000 processors. With double the performance compared to the earlier launched AMD Ryzen Embedded V1000, the module has good performance per watt, and finds its sweetest spot in 15W TDP designs.
SMARC 2.1 modules with NXP i.MX 8M Plus processor
congatec has presented its new low power SMARC 2.1 Computer-on-Modules with NXP i.MX 8M Plus processor for industrial edge analytics, embedded vision and artificial intelligence (AI) at embedded world 2021 DIGITAL.
New COM-HPC starter set at embedded world
congatec has presented a new COM-HPC starter set at embedded world 2021 DIGITAL. Optimised for modular system designs utilising the latest high-speed interface technologies such as PCIe Gen4, USB 4.0 and up to ultra fast 2x25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel Core processor technology (cod...
Extended temperature range platforms for edge computing
congatec has focused on customers’ ruggedisation challenges for virtual embedded world 2021, and will be presenting extended temperature range platforms for all performance levels, from high-end COM-HPC to low power SMARC modules.
Eight cores for heterogeneous edge computing
Tasks at the embedded edge are getting more and more complex. Supporting up to eight cores and 16 threads, the recently launched AMD Ryzen Embedded V2000 processors are hoping to pave the way for x86-based embedded designs with high compute density and performance per watt.
congatec introduces new ecosystem for COM-HPC
congatec has introduced the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are a major milestone for the COM-HPC integration and have been created to accelerate the utilisation of congatec’s COM-HPC modules based on the latest 11th Gen Intel Core processors (code name Tiger Lake).
AMD Ryzen Embedded V2000 processor on COM Express Compact
congatec has broadened the application areas of its AMD Ryzen Embedded processor based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched today on the COM Express Compact footprint.
New platforms for tactile internet applications
congatec has introduced new application-ready platforms for tactile internet applications over public broadband as well as private IP networks. They support Time Sensitive Networking (TSN) in combination with the new Intel Time Coordinated Computing (Intel TCC) technology, which complements the TSN Ethernet standard based on latest Intel IP technology.
Computer-on-Modules to withstand extreme temperatures
congatec has introduced six new Computer-on-Modules with 11th Gen Intel Core processors for the extended temperature range. Built with high-quality components designed to withstand extreme temperatures from -40 to +85°C, the new COM-HPC and COM Express Type 6 Computer-on-Modules provide all features and services required for reliable operation in the most challenging environments.
Solution platform offering to rugged fog computing market
congatec has announced that it is expanding its embedded and edge computing solution platform offering to include the new market of rugged fog computer technologies. Used in various industrial as well as critical network applications, rugged fog computers reside in the network computing and communication pyramid above the edge device layer.
AMD Ryzen embedded V2000 processor on COM Express Compact
congatec has significantly broadened the application areas of its AMD Ryzen Embedded processor based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched on the COM Express Compact footprint.
congatec Computer-on-Modules with Intel Core processors
congatec has announced the launch of 12 brand new Computer-on-Modules in parallel with the Intel IOTG (Internet of Things Group) launch of the 11th Gen Intel Core processors. Based on the new low-power high-density Tiger Lake SoCs the new modules offer greater CPU performance and higher GPU performance along with PCIe Gen4 and USB4 support.
First COM-HPC and next-gen COM Express
In parallel with the 11th Gen Intel Core processor launch (code named “Tiger Lake”), congatec has announced the availability of both its first COM-HPC Client size A module and a next generation COM Express Compact Computer-on-Module. This provides engineers the choice to further scale the performance of their existing systems or develop the next generation of products utilising COM-HPC’s broader array of interfaces.
DBAG invests in congatec to accelerate edge computing
The Deutsche Beteiligungs AG (DBAG) is investing in congatec. Today, with more than two-thirds of congatec's revenue coming from customers based in Europe, congatec expects to see its share of sales with customers in the USA and Asia growing rapidly, and also expects this trend to accelerate.