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Design
4th September 2020
First COM-HPC and next-gen COM Express

In parallel with the 11th Gen Intel Core processor launch (code named “Tiger Lake”), congatec has announced the availability of both its first COM-HPC Client size A module and a next generation COM Express Compact Computer-on-Module. This provides engineers the choice to further scale the performance of their existing systems or develop the next generation of products utilising COM-HPC’s broader array of interfaces.

Latest
24th August 2020
DBAG invests in congatec to accelerate edge computing

The Deutsche Beteiligungs AG (DBAG) is investing in congatec. Today, with more than two-thirds of congatec's revenue coming from customers based in Europe, congatec expects to see its share of sales with customers in the USA and Asia growing rapidly, and also expects this trend to accelerate.

Design
27th July 2020
COM express module with AMD Ryzen Embedded R1000

congatec has extended its conga-TR4 series of COM Express modules with processors from the new AMD Ryzen Embedded R1000 series. Based on the acclaimed Zen microarchitecture, this new generation of energy-efficient processors delivers the best low-power computing performance in its class and is optimised for price sensitive markets.

Design
16th June 2020
Workload consolidation Intel IoT RFP Kit from congatec

congatec has presented its brand new workload consolidation kit for vision based situational awareness that is qualified by Intel as Intel IoT RFP (Ready For Production) Kit. Based on a COM Express Type 6 module equipped with Intel Xeon E2 processor, the RFP kit has three virtual machines (VMs) built on Real-Time Systems' hypervisor technology for workload consolidation in vision applications.

Boards/Backplanes
29th May 2020
Application-ready congatec COM/carrier combo

congatec has announced its brand new conga-SMC1/SMARC-x86 3.5" carrier board. The new size-optimised SMARC 2.1 carrier board in 3.5" form factor is application-ready and off-the-shelf deployable in small to mid sized series in combination with any congatec SMARC Computer-on-Module available to date.

Latest
22nd May 2020
West Pond is helping isolated seniors

congatec has recognised West Pond Technologies for its social isolation breaking AV headend technology. Stepping up to the challenges of social distancing triggered by COVID-19, West Pond is helping residents in senior living facilities to transcend their isolation by connecting them to the community around them.

Design
5th May 2020
Ultra-rugged quad core module from congatec

congatec has introduced its new conga-TR4 COM Express Type 6 module with AMD Ryzen Embedded V1000 Series processors for the industrial temperature range from -40 to +85°C. It is available with optional burn-in & cold-soak stress screening service for highest reliability.

Design
24th March 2020
Advanced connectivity for embedded vision and the edge

congatec has announced that SGET has approved the new SMARC 2.1 specification for embedded vision. With Christian Eder as editor, congatec was reportedly instrumental in shaping the specification. 

Design
6th March 2020
Cooling solutions for edge server ecosystem

congatec has presented three cooling solutions for the new 100W edge server ecosystem that is being built around AMD EPYC Embedded 3000 Series Processors. With rugged cooling solutions and processor modules for 24/7 operation from a single source, OEMs no longer need to think about how to design in a processor waste heat management system.

Design
6th March 2020
SMARC modules make new 3.5” boards scalable

After its successful entry into the 3.5” SBC market in the middle of last year, congatec has now introded a new carrier board in this standardised footprint, which impresses with a socket for Arm based SMARC modules. Its I/Os are optimised for use with congatec's entire NXP i.MX8 module portfolio and it comes in 12 different processor configuration.

Boards/Backplanes
28th February 2020
Processors bring compute power to industrial fields

congatec has announced that the new conga-JC370 3.5-inch SBC with 8th generation Intel Core processors (code name Whiskey Lake) has received excellent design ratings in independent studies carried out by Elektor Magazine and also earned phenomenal positions in UserBenchmark speed tests.

Design
10th February 2020
From high-end to ultra-low-power edge servers

In its embedded world 2020 showcase, congatec has announced that it will be covering the entire spectrum of embedded edge computing, ranging from high-end edge servers to headless systems for ultra-low-power edge logic.

Design
4th February 2020
New low-end performance class for SMARC

congatec has introduced a new SMARC 2.0 Computer-on-Module with Arm Cortex-A53 based NXP Semiconductors i.MX 8M Nano processor. The conga-SMX8-Nano defines a new low-end performance class for SMARC.

Analysis
9th January 2020
Embedded edge computing: requirements have increased

Today, embedded computers are often deployed as edge computers. This is not just a buzzword but the answer to increased demands for IIoT-connected devices, machines and systems. Intel and congatec are addressing these new challenges with an extended ecosystem that is strongly geared towards concrete solutions and goes far beyond core processor functions. By Andreas Bergbauer is Product Line Manager for COM Express at congatec

Analysis
5th December 2019
Ecosystem for embedded edge and micro servers

congatec launched its new 100W ecosystem for embedded edge and micro servers at CIIF 2019. The ecosystem is designed for embedded edge and micro servers that increasingly utilise 65 to 100W COM Express Type 7 Server-on-Module performance for most cost-efficient scalability. 

Artificial Intelligence
2nd December 2019
Embedded computing kit for AI uses Sparse Modeling

congatec and the Japanese AI experts at Hacarus have unveiled an embedded computing kit for Artificial Intelligence (AI) that uses Sparse Modeling technology. Sparse Modeling needs little training data to make highly accurate predictions. This is an advantage for vision-based inspection systems, among others, because the reject rate is naturally lower when manufacturing quality is high.

Design
18th November 2019
Embedded boards with 8th generation Intel Core processors

congatec has intensified its sales and marketing activities in Eastern Europe. With the support of local sales partner Ineltro, congatec aspires to become the number one provider of embedded computer boards and modules in Poland. The first visible sign of this increased local presence was congatec's participation at the Evertiq Expo.

Boards/Backplanes
4th November 2019
Lower power computing with Arm

The modules featuring NXP i.MX 8 multi-core 32- and 64-bit ARM processors, which congatec offers in the SMARC 2.0 and Qseven standards, are robust and some are designed for the extended temperature range from -40°C to +85°C. They are predestined for a wide range of applications and even allow full solar operation with an energy consumption of less than 3-5W during normal operation. Here congatec discusses the potential industrial applicat...

Design
12th September 2019
Module with mini processor offers higher performance

congatec has introduced a new SMARC 2.0 Computer-on-Module with NXP i.MX 8M Mini processor. The conga-SMX8-Mini offers higher performance at significantly fewer watts due to the new 14nm FinFET structure. The module also offers impressive visualisation capabilities, including 3D graphics with full-HD resolution, despite low thermal and system cost.

Design
30th July 2019
New high end modules designed for embedded edge computing

congatec has announced 10 new COM Express Type 6 modules featuring the best and latest Intel embedded processor technology. The four Intel Xeon, three Intel Core, two Intel Celeron and one Intel Pentium processors are all based on the same Intel microarchitecture. This enables congatec to provide all 10 processors on one COM Express module design the conga-TS370. A total of 14 processor module variants are now available on this single microarchit...

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