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congatec

congatec Articles

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Boards/Backplanes
17th November 2020
congatec introduces new ecosystem for COM-HPC

congatec has introduced the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are a major milestone for the COM-HPC integration and have been created to accelerate the utilisation of congatec’s COM-HPC modules based on the latest 11th Gen Intel Core processors (code name Tiger Lake).

Boards/Backplanes
17th November 2020
AMD Ryzen Embedded V2000 processor on COM Express Compact

congatec has broadened the application areas of its AMD Ryzen Embedded processor based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched today on the COM Express Compact footprint.

Boards/Backplanes
16th November 2020
New platforms for tactile internet applications

congatec has introduced new application-ready platforms for tactile internet applications over public broadband as well as private IP networks. They support Time Sensitive Networking (TSN) in combination with the new Intel Time Coordinated Computing (Intel TCC) technology, which complements the TSN Ethernet standard based on latest Intel IP technology.

Design
13th November 2020
Computer-on-Modules to withstand extreme temperatures

congatec has introduced six new Computer-on-Modules with 11th Gen Intel Core processors for the extended temperature range. Built with high-quality components designed to withstand extreme temperatures from -40 to +85°C, the new COM-HPC and COM Express Type 6 Computer-on-Modules provide all features and services required for reliable operation in the most challenging environments.

Design
12th November 2020
Solution platform offering to rugged fog computing market

congatec has announced that it is expanding its embedded and edge computing solution platform offering to include the new market of rugged fog computer technologies. Used in various industrial as well as critical network applications, rugged fog computers reside in the network computing and communication pyramid above the edge device layer.

Design
12th November 2020
AMD Ryzen embedded V2000 processor on COM Express Compact

congatec has significantly broadened the application areas of its AMD Ryzen Embedded processor based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched on the COM Express Compact footprint.

Boards/Backplanes
12th October 2020
congatec Computer-on-Modules with Intel Core processors

congatec has announced the launch of 12 brand new Computer-on-Modules in parallel with the Intel IOTG (Internet of Things Group) launch of the 11th Gen Intel Core processors. Based on the new low-power high-density Tiger Lake SoCs the new modules offer greater CPU performance and higher GPU performance along with PCIe Gen4 and USB4 support.

Design
4th September 2020
First COM-HPC and next-gen COM Express

In parallel with the 11th Gen Intel Core processor launch (code named “Tiger Lake”), congatec has announced the availability of both its first COM-HPC Client size A module and a next generation COM Express Compact Computer-on-Module. This provides engineers the choice to further scale the performance of their existing systems or develop the next generation of products utilising COM-HPC’s broader array of interfaces.

Latest
24th August 2020
DBAG invests in congatec to accelerate edge computing

The Deutsche Beteiligungs AG (DBAG) is investing in congatec. Today, with more than two-thirds of congatec's revenue coming from customers based in Europe, congatec expects to see its share of sales with customers in the USA and Asia growing rapidly, and also expects this trend to accelerate.

Design
27th July 2020
COM express module with AMD Ryzen Embedded R1000

congatec has extended its conga-TR4 series of COM Express modules with processors from the new AMD Ryzen Embedded R1000 series. Based on the acclaimed Zen microarchitecture, this new generation of energy-efficient processors delivers the best low-power computing performance in its class and is optimised for price sensitive markets.

Design
16th June 2020
Workload consolidation Intel IoT RFP Kit from congatec

congatec has presented its brand new workload consolidation kit for vision based situational awareness that is qualified by Intel as Intel IoT RFP (Ready For Production) Kit. Based on a COM Express Type 6 module equipped with Intel Xeon E2 processor, the RFP kit has three virtual machines (VMs) built on Real-Time Systems' hypervisor technology for workload consolidation in vision applications.

Boards/Backplanes
29th May 2020
Application-ready congatec COM/carrier combo

congatec has announced its brand new conga-SMC1/SMARC-x86 3.5" carrier board. The new size-optimised SMARC 2.1 carrier board in 3.5" form factor is application-ready and off-the-shelf deployable in small to mid sized series in combination with any congatec SMARC Computer-on-Module available to date.

Latest
22nd May 2020
West Pond is helping isolated seniors

congatec has recognised West Pond Technologies for its social isolation breaking AV headend technology. Stepping up to the challenges of social distancing triggered by COVID-19, West Pond is helping residents in senior living facilities to transcend their isolation by connecting them to the community around them.

Design
5th May 2020
Ultra-rugged quad core module from congatec

congatec has introduced its new conga-TR4 COM Express Type 6 module with AMD Ryzen Embedded V1000 Series processors for the industrial temperature range from -40 to +85°C. It is available with optional burn-in & cold-soak stress screening service for highest reliability.

Design
24th March 2020
Advanced connectivity for embedded vision and the edge

congatec has announced that SGET has approved the new SMARC 2.1 specification for embedded vision. With Christian Eder as editor, congatec was reportedly instrumental in shaping the specification. 

Design
6th March 2020
Cooling solutions for edge server ecosystem

congatec has presented three cooling solutions for the new 100W edge server ecosystem that is being built around AMD EPYC Embedded 3000 Series Processors. With rugged cooling solutions and processor modules for 24/7 operation from a single source, OEMs no longer need to think about how to design in a processor waste heat management system.

Design
6th March 2020
SMARC modules make new 3.5” boards scalable

After its successful entry into the 3.5” SBC market in the middle of last year, congatec has now introded a new carrier board in this standardised footprint, which impresses with a socket for Arm based SMARC modules. Its I/Os are optimised for use with congatec's entire NXP i.MX8 module portfolio and it comes in 12 different processor configuration.

Boards/Backplanes
28th February 2020
Processors bring compute power to industrial fields

congatec has announced that the new conga-JC370 3.5-inch SBC with 8th generation Intel Core processors (code name Whiskey Lake) has received excellent design ratings in independent studies carried out by Elektor Magazine and also earned phenomenal positions in UserBenchmark speed tests.

Design
10th February 2020
From high-end to ultra-low-power edge servers

In its embedded world 2020 showcase, congatec has announced that it will be covering the entire spectrum of embedded edge computing, ranging from high-end edge servers to headless systems for ultra-low-power edge logic.

Design
4th February 2020
New low-end performance class for SMARC

congatec has introduced a new SMARC 2.0 Computer-on-Module with Arm Cortex-A53 based NXP Semiconductors i.MX 8M Nano processor. The conga-SMX8-Nano defines a new low-end performance class for SMARC.

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