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congatec

congatec Articles

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Micros
29th March 2022
Intertraffic Amsterdam: congatec

congatec, a vendor of embedded and edge computing technology – is pleased to introduce new rugged vehicle computing platforms for smart mobility applications in the extended temperature range at Intertraffic Amsterdam, Hall 5/Booth 309.

Memory
25th February 2022
World premiere for x86 based COM-HPC Server

congatec, a vendor of embedded and edge computing technology, celebrates the world premiere for x86 based COM-HPC Server modules by announcing the availability of three new Server-on-Module families parallel to the launch of the brand-new Intel Xeon D processor family, formerly codenamed Ice Lake D.

Design
10th February 2022
Congatec simplifies COM-HPC designs

Congatec a vendor of embedded and edge computing technology – welcomes the publication of the COM-HPC Carrier Board Design Guide by the PCI Industrial Computer Manufacturers Group (PICMG) with the launch of a fully specification compliant ecosystem for engineers of COM-HPC Client and Server module based designs. 

IoT
5th January 2022
A quantum leap in core count

congatec – a vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. 

Latest
1st December 2021
Round-the-clock accessibility provided by congatec

congatec has opened a digital trade show booth as a permanent exhibition on their website, providing additional learning opportunities for potential customers who are unable to attend trade fairs and exhibitions due to the pandemic, 

Artificial Intelligence
17th November 2021
Computer-on-Modules meet functional safety and security

congatec has announced its strategic partnership with SYSGO to create Computer-on-Modules meet functional safety and security

5G
4th November 2021
Congatec introduces real-time over the air platform

Congatec introduces new platforms and design strategies for 5G connected mobile and stationary devices

Design
15th July 2021
Ultra-rugged Intel Core modules with soldered RAM

congatec has introduced new 11th Gen Intel Core processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40 to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications.

Boards/Backplanes
9th June 2021
Fast track to NPU accelerated embedded vision

congatec has extended its i.MX 8 ecosystem with a new starter set for AI accelerated intelligent embedded vision applications. Based on a SMARC Computer-on-Module with i.MX 8M Plus processor, the starter set’s sweet spot is the utilisation of the new processor integrated NXP Neural Processing Unit (NPU).

Latest
26th May 2021
congatec to expand its business in Korea

congatec has announced the foundation of congatec Korea to meet increasing customer demand in South Korea. The establishment of a new subsidiary underlines the importance of Korea for congatec’s global business success.

Artificial Intelligence
17th May 2021
AI to make healthcare smarter at CMEF

The congatec CMEF showcase put the spotlight on the latest embedded computing and artificial intelligence (AI) technologies for medical imaging and diagnostics, operating theaters as well as mobile emergency and intensive care equipment.

Boards/Backplanes
17th March 2021
SMARC 2.1 modules with NXP i.MX 8M Plus processor

congatec has presented a low power SMARC 2.1 Computer-on-Modules with NXP i.MX 8M Plus processor for industrial edge analytics, embedded vision and artificial intelligence (AI) at embedded world 2021 DIGITAL.

Boards/Backplanes
15th March 2021
COM-HPC starter set with 11th Gen Intel Core processors

congatec has introduced a brand new COM-HPC starter set. Optimised for modular system designs utilising the latest high-speed interface technologies such as PCIe Gen4, USB 4.0 and up to ultra fast 2x25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel Core processor technology (code name Tiger Lake).

Design
5th March 2021
Doubled performance with Ryzen Embedded V2000 processor

congatec has introduced the conga-TCV2, a COM Express Compact Computer-on-Module based on AMD Ryzen Embedded V2000 processors. With double the performance compared to the earlier launched AMD Ryzen Embedded V1000, the module has good performance per watt, and finds its sweetest spot in 15W TDP designs.

Boards/Backplanes
5th March 2021
SMARC 2.1 modules with NXP i.MX 8M Plus processor

congatec has presented its new low power SMARC 2.1 Computer-on-Modules with NXP i.MX 8M Plus processor for industrial edge analytics, embedded vision and artificial intelligence (AI) at embedded world 2021 DIGITAL.

Boards/Backplanes
5th March 2021
New COM-HPC starter set at embedded world

congatec has presented a new COM-HPC starter set at embedded world 2021 DIGITAL. Optimised for modular system designs utilising the latest high-speed interface technologies such as PCIe Gen4, USB 4.0 and up to ultra fast 2x25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel Core processor technology (cod...

Boards/Backplanes
19th February 2021
Extended temperature range platforms for edge computing

congatec has focused on customers’ ruggedisation challenges for virtual embedded world 2021, and will be presenting extended temperature range platforms for all performance levels, from high-end COM-HPC to low power SMARC modules. 

Industrial
5th February 2021
Eight cores for heterogeneous edge computing

Tasks at the embedded edge are getting more and more complex. Supporting up to eight cores and 16 threads, the recently launched AMD Ryzen Embedded V2000 processors are hoping to pave the way for x86-based embedded designs with high compute density and performance per watt.

Boards/Backplanes
17th November 2020
congatec introduces new ecosystem for COM-HPC

congatec has introduced the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are a major milestone for the COM-HPC integration and have been created to accelerate the utilisation of congatec’s COM-HPC modules based on the latest 11th Gen Intel Core processors (code name Tiger Lake).

Boards/Backplanes
17th November 2020
AMD Ryzen Embedded V2000 processor on COM Express Compact

congatec has broadened the application areas of its AMD Ryzen Embedded processor based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched today on the COM Express Compact footprint.

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