congatec

Address:
Auwiesenstr. 5
Deggendorf
94469
Germany

Phone: +49 991 27000

Web: www.congatec.com


congatec articles

Displaying 1 - 20 of 150

Modules accelerate first-to-market strategies

Modules accelerate first-to-market strategies
  congatec has announced support of the new 64-bit NXP i.MX8 processors for the Qseven and SMARC module standards. As a member of NXP's Early Access Programme, the new congatec modules will be available in time with the production launch of the new ARM Cortex A53 / A72 based processor family.
28th November 2017

Smart manufacturing IT platforms on display at CIIF 2017

Smart manufacturing IT platforms on display at CIIF 2017
At CIIF, China International Industry Fair in Shanghai, the Taiwan located subsidiary of congatec will present smart manufacturing IT platforms for 'Made in China 2025' (MIC 2025) solutions in hall 6.1H, booth A065. These instantly deployable computing platforms enable Chinese machine building and manufacturing systems engineers to develop smart, connected manufacturing equipment as well as robotics and intra-logistics devices with situational awareness for collaborative manufacturing.
3rd November 2017

Modules improve embedded edge computing

Modules improve embedded edge computing
congatec has announced the launch of the conga-B7AC, a new Intel Atom C3000 processor based COM Express Type 7 Server-on-Module that raises the bar for embedded edge computing through 10 GbE bandwidth support. With a power consumption starting at only 11 Watt, the new low-power multicore Server-on-Modules with up to 16 cores offer up to 4x 10 GbE real-time capable network performance.
21st September 2017


congatec lays the foundation for modular micro server designs

congatec lays the foundation for modular micro server designs
congatec has launched the COM Express Type 7 quick starter set as the fundamental basis for OEMs' modular micro-server designs. The quick starter set simplifies the evaluation of the first server-on-modules designed in accordance to PICMG's COM Express Type 7 standard, poised to be globally deployed in cloud, edge and fog server applications.
7th August 2017

Personal integration support announced at COMPUTEX 2017

Personal integration support announced at COMPUTEX 2017
At COMPUTEX TAIPEI (Booth J1224), congatec will announce the global availability of its personal integration support for OEMs. Personal integration support is a premium service from congatec designed to simplify the use of embedded computing technologies. OEM customers around the globe benefit from a single contact point to get all their design-in questions answered. There is no need to wait in an impersonal hotline or speak to constantly changing contact persons.
26th May 2017

High-end robotics computing technology on show at ESEC 2017

High-end robotics computing technology on show at ESEC 2017
At the Embedded Systems Expo & Conference (ESEC 2017) in Japan (West Hall 1F, booth W4-20), congatec will spotlight its new high-end embedded computing portfolio for robotics and real-time automation. Designed from the ground up to meet highest 'made in Germany' quality standards, the comprehensive product portfolio includes the hypervisor technology from Real-Time Systems, consolidating the congatec robotics computing offering in a single, application ready, 4-in-1 hardware platform for PLC, HMI, IoT and Industry 4.0 systems.
15th May 2017

Type 7 Server-on-Modules conform to PICMG standard

Type 7 Server-on-Modules conform to PICMG standard
  congatec has welcomed the PICMG release of the COM Express 3.0 specification. The revision 3.0 of the specification formally integrates the new Type 7 pinout type which is the basis for congatec's Server-on-Modules. The official release fires the starting shot for the race to a new generation of server designs based on standardised Server-on-Modules.
20th April 2017

Cloud API simplifies orchestration of wireless sensor networks

Cloud API simplifies orchestration of wireless sensor networks
A best practice design solution for the simplified orchestration of wireless sensor networks was showcased by congatec at embedded world 2017. It is based on the new, application ready congatec Cloud API (Application Programming Interface) for IoT gateways that is capable of integrating any local sensor networks into any cloud solution.
10th April 2017

congatec further standardises interface setup for SMARC 2.0

congatec further standardises interface setup for SMARC 2.0
  congatec has introduced a SMARC 2.0 module supporting powerful USB-C connectivity. The utilisation of the USB-C specification makes USB interconnects even more universally applicable, further standardising the interface setup of SMARC 2.0-based embedded devices.
28th March 2017

Motherboard is designed for IoT connected devices

Motherboard is designed for IoT connected devices
  congatec has introduced the conga-IC175, a thin industrial-grade motherboard family featuring the 7th Gen Intel Core U (Kaby Lake) processors designed for IoT connected devices. The new boards are suited for space-constrained, high-performance, low-power IoT designs.
10th March 2017

Module specialist strengthens UK presence

Module specialist strengthens UK presence
Martin C. Frederiksen has recently been appointed as the new congatec Sales Director for Northern Europe to strengthen the company’s sales and support organisation in the UK and in Scandinavia. Together with the appointment of Martin Frederiksen, the Northern European sales team has been extended further with the addition of Anders Rasmussen and Jon Moseley as Key Account Managers. Additionally, congatec has recently created a new, wholly owned London-based subsidiary.
1st February 2017

COM Express modules have Gen 7 Intel Core processors

COM Express modules have Gen 7 Intel Core processors
congatec has released COM Express Compact modules in time with the launch of the 7th generation of Intel Core SoC processors. The conga-TC175 Computer-on-Modules (COMs) with Intel's Skylake successor -the second variant of the current 14nm microarchitecture - are simply better than their predecessors. Compelling features include greater CPU performance, more dynamic HDR graphics thanks to 10-bit video codec, and support of the optional, super-fast 3D Xpoint-based Intel Optane memory.
4th January 2017

Boosting module-based high-end embedded computing

Boosting module-based high-end embedded computing
congatec extends its COM Express Basic portfolio with the new high-performance conga-TS175 Computer-on-Module. Equipped with the high-end dual chip versions of the brand new Intel Xeon and Gen 7 Intel Core processors (codename Kaby Lake), it sets a new benchmark for module-based high-end embedded computers and modular industrial workstations that need to process massive workloads.
4th January 2017

COM Express Mini module offers more than any module before

COM Express Mini module offers more than any module before
congatec has released the conga-MA5, the next generation of low-power modules for the industrial and extended temperature range in the credit card sized COM Express Mini form factor. The new COM Express Type 10 Computer-on-Modules are equipped with the latest Intel Atom, Celeron and Pentium processors (code name Apollo Lake) and impress with 30% more processing power and 45% more graphics performance on a very small COM Express Mini module.
8th December 2016

congatec strives to become embedded go-to provider in France

congatec strives to become embedded go-to provider in France
congatec has founded a new subsidiary in France with offices in Paris and Toulouse to strengthen its sales and support organisation in France and the French speaking regions of Belgium and Switzerland. The aim of the new congatec France SAS is the intensified roll-out of the congatec brand as the natural go-to provider for embedded modules and SBCs in France, as congatec is in Germany. Luc Beugin will manage our office in Paris. Stephane Mailleau will operate from Toulouse.
7th December 2016

Mini-ITX and Pico-ITX boards feature security enhancements

Mini-ITX and Pico-ITX boards feature security enhancements
The conga-PA5 Pico-ITX single board computer and the conga-IA5 Thin Mini-ITX motherboard, two industrial-grade, long-term available computing platforms featuring the latest Intel Atom, Celeron and Pentium processors, has been introduced by congatec. System engineers can immediately deploy them to upgrade existing Pico-ITX and Mini-ITX designs and benefit from approximately 30% more processing power and 45% more graphics performance compared to the previous generations.
15th November 2016

Quick Starter Kit for SMARC 2.0 aids Intel Atom processors

Quick Starter Kit for SMARC 2.0 aids Intel Atom processors
congatec presents the SMARC 2.0 Quick Starter Kit for Intel Atom processors (code name Apollo Lake). The kit comes with congatec’s first SMARC 2.0 module – the conga-SA5 – and everything developers need for the immediate evaluation of the new SMARC 2.0 standard as well as the latest Intel Atom processor generation. Application engineers of connected Industry 4.0 and wireless IoT devices will love the option of the integrated wireless interfaces with standardised antenna connectors on board.
15th November 2016

Low power processor modules available for every budget

Low power processor modules available for every budget
congatec has released COM Express Compact and Qseven Computer-on-Modules in time with the launch of Intel’s low-power processors (code name Apollo Lake). The modules with Intel Atom, Celeron and Pentium processors feature the powerful Intel Gen 9 graphics and deliver an impressive performance per watt improvement, enabling the implementation of even more powerful designs with even lower energy consumption.
26th October 2016

First COM Express Type 7 modules with Intel Xeon D processors

First COM Express Type 7 modules with Intel Xeon D processors
Parallel to the preview release of the COM Express Type 7 specification, congatec is introducing new Server-on-Modules with Intel Xeon D processors (codename Broadwell). Based on the COM Express Basic standard form factor (95x125mm), the modules feature 10 Gigabit Ethernet interfaces, 32 PCIe lanes and headless server performance currently with up to 16 server cores and 48GB of DDR4 ECC RAM.
13th October 2016

Embedded COM tech supports new module specification

Full support of the new SMARC 2.0 specification, which was released by the Standardisation Group for Embedded Technologies e.V. (SGET) just a few days ago has been announced by congatec. This major technology adaption extends congatec’s leading and extensive COM portfolio to include a brand new solution which is perfectly positioned between Qseven and COM Express.
1st July 2016


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