Newly integrated IIoT capabilities create added value

15th February 2024
Paige West

Congatec is set to unveil a series of new IIoT Computer-on-Modules at embedded world (Hall 3, Booth 241).

Highlighting these innovations are modules powered by the latest Intel Core Ultra processors with built-in AI capabilities. Additionally, congatec will introduce modules featuring both low-power and high-performance x86 processor technologies. The showcase will emphasise enhanced performance, energy efficiency, and the integration of advanced IIoT and security features, marking a first in the Computer-on-Module (COM) market. These advancements aim to elevate the readiness of COMs for applications, facilitating the development of modern, multifunctional, and fully connected embedded and IIoT devices.

"IIoT poses significant challenges for OEMs, challenges we are addressing by significantly enhancing the functionality of our COM-HPC, COM Express, SMARC, and Qseven modules. For instance, the integration of hypervisor technology and IIoT capabilities into our modules simplifies the process for solution providers to augment their applications with additional functionalities without needing to develop or integrate these features independently. We look forward to showcasing the value these new functionalities provide to our OEM customers at embedded world," said Tim Henrichs, Vice President of Marketing at congatec.

To meet the increasing digitalisation and IIoT connectivity demands, OEMs' embedded systems must incorporate a broader range of functionalities. congatec meets these elevated requirements with its proprietary hypervisor technologies and edge IoT features, among others. The company will present, for the first time at embedded world, how these solutions are seamlessly integrated into the enhanced features of its Computer-on-Modules.

The introduction of expanded IIoT capabilities in its Computer-on-Modules reflects congatec's strategy to add value. congatec is recognised for extended functionalities and services that simplify the integration of COM Express, COM-HPC, SMARC, and Qseven modules. The congatec ecosystem includes tailored cooling solutions, carrier boards for straightforward evaluation and application design, software support, and personalised integration services. Additionally, congatec’s testing and design services offer OEMs time and effort savings, making module integration more straightforward and secure, thus accelerating time-to-market, and enabling customers to navigate rapid innovation cycles effectively.

congatec's modules not only encompass all functional areas from processor capabilities and form factors but also provide unparalleled efficiency and convenience for OEMs. The integration of new virtualisation, digitalisation, and security features sets a new standard for the capabilities of application-ready Computer-on-Modules, especially in real-time IIoT applications.

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