Duo lead way to qubit chips at wafer scale
CEA and C12 Quantum Electronics, a start-up focused on developing the next-generation of quantum computers using carbon nanotubes have announced a partnership to produce the first multi-qubit chips at wafer scale.
"World’s first" multi-sensor system for knee implants
CEA-Leti, a CEA microelectronics research institute, will introduce a smart, integrated multi-sensor system for knee implants at CES 2022 that can help surgeons more accurately position the implant, dramatically reduce risk of follow-up surgery, and enhance rehabilitation.
HfO2-based FeRAM arrays designed & fabricated at CEA-Leti
CEA-Leti has reported the world’s-first demonstration of 16-kbit ferroelectric random-access memory (FeRAM) arrays at the 130nm node that advances this energy-saving technology closer to commercialisation. The breakthrough includes back-end-of-line (BEOL) integration of TiN/HfO2:Si/TiN ferroelectric capacitors as small as 0.16 µm², and solder reflow compatibility for the first time for this type of memory.
Main challenges facing large-scale Si quantum computing
CEA, in collaboration with CNRS Néel, a team in SI-based quantum computing, presented two papers on that topic at IEDM 2021, including an invited paper that identifies the material and integration challenges facing large-scale Si quantum computing.
Next-generation memories with RRAM energy-storage
CEA-Leti has proposed a “newfangled approach” that allows these devices to operate as energy-storage elements as well as memory, depending on the applied bias.