CEA-Leti Articles

Displaying 1 - 16 of 16
22nd March 2024
First-reported fully vascularised organoids on chip

The Interdisciplinary Research Institute of Grenoble (CEA-Irig), CEA-Leti and fellow European and Canadian institutes and researchers have demonstrated the complete vascularisation of organoids on a microfluidic chip at speeds and flow rates similar to blood’s, improving functional maturation and enabling their long-term survival.

27th February 2024
EU Consortium is accepting design proposals

A new European Union consortium created to accelerate the development of next-generation, Edge-AI technologies is installing cleanroom tools and gearing up to design, evaluate, test, and fabricate new circuits from across Europe.

21st February 2024
310% loss reduction in piezoelectric IC conversion achieved

University of California San Diego and CEA-Leti scientists have developed a piezoelectric-based DC/DC converter that unifies all power switches onto a single chip to increase power density.

News & Analysis
26th January 2024
Progress towards microLED bandwidth and efficiency improvement

CEA-Leti is poised to present two papers on its advancements in microLED technology at Photonics West 2024, focusing on the creation of LED matrices with enhanced data-rate density and methods to mitigate their efficiency loss at reduced sizes.

18th October 2023
Improve ‘cooperation’ between autonomous vehicles

CEA-Leti announced a new R&D initiative to contribute to a higher level of vehicle automation and cooperation by expanding the latest developments in vehicular wireless communications that improve reaction time, pedestrian detection, and overall vehicle performance.

19th June 2023
CEA-Leti & Intel to develop atomically thin 2D TMDs

CEA-Leti and Intel have announced a joint research project to develop layer transfer technology of two-dimensional transition-metal dichalcogenides (2D TMDs) on 300mm wafers with the goal to extend Moore’s Law beyond 2030.

2nd June 2023
CEA-Leti proof of concept demonstrates electron behaviours

CEA-Leti research scientists have demonstrated that electrons and other charge carriers can move faster in germanium tin than in silicon or germanium, enabling lower operation voltages and smaller footprints in vertical than in planar devices.

27th September 2022
RF chip for IoT connectivity via Astrocast’s nanosatellite network

CEA, a technology-research organisation, and Astrocast, a leading global satellite Internet of Things network operator, have announced their successful collaboration on a low-cost, bidirectional communication module that enables corporations to communicate with their remote assets in areas not covered by terrestrial networks.

7th July 2022
CEA-Leti barn-owl inspired object localisation system

Inspired by the barn owl’s neuroanatomy, CEA-Leti has developed an event-driven, object-localisation system that couples state-of-the-art piezoelectric, ultrasound transducer sensors to a neuromorphic, resistive memories-based computational map.

News & Analysis
6th June 2022
CEA-Leti & Intel report die-to-wafer self-assembly breakthrough

In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimised a hybrid direct-bonding, self-assembly process that has the potential to increase the alignment accuracy as well as fabrication throughput by several thousand dies per hour.

Events News
2nd June 2022
6G applications scrutinised at Grenoble conferences

Anticipating that 6G systems will offer a major step change in performance from gigabit towards terabit capacities and sub-millisecond response times, the top two European conferences for communication networks will meet June 7-10 to explore future critical 6G applications.

News & Analysis
29th March 2022
Duo lead way to qubit chips at wafer scale

CEA and C12 Quantum Electronics, a start-up focused on developing the next-generation of quantum computers using carbon nanotubes have announced a partnership to produce the first multi-qubit chips at wafer scale.

17th December 2021
"World’s first" multi-sensor system for knee implants

CEA-Leti, a CEA microelectronics research institute, will introduce a smart, integrated multi-sensor system for knee implants at CES 2022 that can help surgeons more accurately position the implant, dramatically reduce risk of follow-up surgery, and enhance rehabilitation.

16th December 2021
HfO2-based FeRAM arrays designed & fabricated at CEA-Leti

CEA-Leti has reported the world’s-first demonstration of 16-kbit ferroelectric random-access memory (FeRAM) arrays at the 130nm node that advances this energy-saving technology closer to commercialisation. The breakthrough includes back-end-of-line (BEOL) integration of TiN/HfO2:Si/TiN ferroelectric capacitors as small as 0.16 µm², and solder reflow compatibility for the first time for this type of memory.

Quantum Tech
16th December 2021
Main challenges facing large-scale Si quantum computing

CEA, in collaboration with CNRS Néel, a team in SI-based quantum computing, presented two papers on that topic at IEDM 2021, including an invited paper that identifies the material and integration challenges facing large-scale Si quantum computing.

2nd December 2021
Next-generation memories with RRAM energy-storage

CEA-Leti has proposed a “newfangled approach” that allows these devices to operate as energy-storage elements as well as memory, depending on the applied bias.

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