CEA-Leti, in collaboration with Quobly, CEA-List and CEA-Irig, has reported developing a unique solution using FD-SOI CMOS technology that provides simultaneous microsecond readouts of tens of quantum devices, while reducing the readout power consumption by 10x and footprint by 2x.

CEA-Leti scientists presented three papers at Photonics West 2025 detailing the institute’s latest R&D successes to improve chemical detection, high-speed communication, and LIDAR performance with integrated optics on silicon.

CEA-Leti research engineers have demonstrated for the first time a scalable hafnia-zirconia-based ferroelectric capacitor platform integrated into the back-end-of-line (BEOL) at the 22nm FD-SOI technology node.

CEA-Leti researchers have developed the first-reported device able to sense light and modulate it accordingly in a single device, using a liquid crystal cell and a CMOS image sensor.

CEA-Leti has announced the launch of an open-source project aimed at developing physical True Random Number Generators (TRNGs) based on ring-oscillator architectures. 

Building on earlier innovations in electrical power conversion through the use of piezoelectric resonators and the development of a dual-bridge piezoelectric resonator converter, CEA-Leti has now achieved a significant milestone in isolating piezoelectric converters without the need for transformers.

NY CREATES and CEA-Leti have announced a strategic collaboration focused on the research and co-development of magnetic memory devices, which are crucial for storing computer data. 

CEA-Leti will present its most recent innovations and breakthroughs to help meet that demand at Leti Innovation Days, June 25-27 in Grenoble.

The Interdisciplinary Research Institute of Grenoble (CEA-Irig), CEA-Leti and fellow European and Canadian institutes and researchers have demonstrated the complete vascularisation of organoids on a microfluidic chip at speeds and flow rates similar to blood’s, improving functional maturation and enabling their long-term survival.

A new European Union consortium created to accelerate the development of next-generation, Edge-AI technologies is installing cleanroom tools and gearing up to design, evaluate, test, and fabricate new circuits from across Europe.

University of California San Diego and CEA-Leti scientists have developed a piezoelectric-based DC/DC converter that unifies all power switches onto a single chip to increase power density.

CEA-Leti is poised to present two papers on its advancements in microLED technology at Photonics West 2024, focusing on the creation of LED matrices with enhanced data-rate density and methods to mitigate their efficiency loss at reduced sizes.

CEA-Leti announced a new R&D initiative to contribute to a higher level of vehicle automation and cooperation by expanding the latest developments in vehicular wireless communications that improve reaction time, pedestrian detection, and overall vehicle performance.

CEA-Leti and Intel have announced a joint research project to develop layer transfer technology of two-dimensional transition-metal dichalcogenides (2D TMDs) on 300mm wafers with the goal to extend Moore’s Law beyond 2030.

CEA-Leti research scientists have demonstrated that electrons and other charge carriers can move faster in germanium tin than in silicon or germanium, enabling lower operation voltages and smaller footprints in vertical than in planar devices.

CEA, a technology-research organisation, and Astrocast, a leading global satellite Internet of Things network operator, have announced their successful collaboration on a low-cost, bidirectional communication module that enables corporations to communicate with their remote assets in areas not covered by terrestrial networks.

Inspired by the barn owl’s neuroanatomy, CEA-Leti has developed an event-driven, object-localisation system that couples state-of-the-art piezoelectric, ultrasound transducer sensors to a neuromorphic, resistive memories-based computational map.

In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimised a hybrid direct-bonding, self-assembly process that has the potential to increase the alignment accuracy as well as fabrication throughput by several thousand dies per hour.

Anticipating that 6G systems will offer a major step change in performance from gigabit towards terabit capacities and sub-millisecond response times, the top two European conferences for communication networks will meet June 7-10 to explore future critical 6G applications.

CEA and C12 Quantum Electronics, a start-up focused on developing the next-generation of quantum computers using carbon nanotubes have announced a partnership to produce the first multi-qubit chips at wafer scale.