ASMPT and IBM have announced a renewed agreement to extend their collaboration on the joint development of the next advancement of chiplet packaging technologies.

ASMPT has added two new features to its DEK printing platforms that automate solder paste transfers and simplify squeegee changes.

At the PCIM Europe event in Nuremberg, ASMPT showcased a comprehensive power module manufacturing solution. 

With its new SIPLACE CA2 hybrid placement solution ASMPT combines semiconductor and SMT production in a single machine that makes it possible to integrate the production of SiPs (system-in-package modules) directly into the SMT line.

On SMT production lines equipped with ASMPT hardware and software, program changes can be executed fully automatically, even in the absence of a barcode reader, by transmitting the data of the respective Printed Circuit Board (PCB) from one machine to another via a standardised interface.    

The new SMT Analytics software from ASMPT evaluates the SMT process in detail by identifying and locating problematic aspects that often go unnoticed and can lead to shortfalls in efficiency and performance. The innovative software helps employees to detect the causes of trouble, highlights potential losses, and points out potential improvements.

ASMPT, the innovation and market pioneer in surface-mount and semiconductor manufacturing technology and a Leadership Level founding member of the Semiconductor Climate Consortium (SCC), has officially announced its Net Zero 2035 strategy for climate neutrality.

ASMPT has unveiled the new version of the AMICRA NOVA Pro in Munich on 17th January 2024. This state-of-the-art platform merges high placement accuracy with swift cycle times and cutting-edge bonding technologies, marking a significant advancement in the field.

Intelligent hardware and software solutions from technology and market leader ASMPT identify defective products in SMT manufacturing.

CMAT-S is an all-in-one system for assembling and dynamically aligning lenses in ADAS cameras.

The SIPLACE TX micron is the answer to the challenges manufacturers face in SiP (system-in-package) production.

ASMPT will present its semiconductor assembly and packaging solutions at Productronica 2023.

From 14―17 November 2023, innovative and internationally successful companies will present their products and services at the leading trade fair for electronics development and manufacturing.

ASMPT has announced another successful event showcasing the DEK TQ L print technology in Brazil.

ASMPT has announced its return to Brazil’s electronics event, FIEE, underscoring the company’s commitment to the region amid its expanding, country-wide sales and service network.

The highly complex and customised production technology on the SMT factory floor requires new, smart ways of working that are based on a solid foundation of knowledge.

ASMPT offer solutions for the entire power module assembly process chain, one of the greatest production challenges in e-mobility.

ASMPT recently announced its full year 2022 results achieving its second highest ever revenue and bookings in spite of a challenging macroeconomic environment and an industry downcycle.

SMT market and ASMPT have entered into a long-term partnership with automation company cts GmbH that aims to improve material flow automation in electronics production from the warehouse to the production line. 

Although the processing of odd-shaped components at the end of the line usually accounts for only about 10% of the entire SMT process, it represents the majority of the challenges in placement operations.