Enhancing its portfolio of power solutions, FCI has introduced the HPCE (High Power Card Edge) BTB (board-to-board) connectors. Specifically designed for applications requiring a high current density and low power loss, the two-piece header and receptacle solution suits applications such as next generation 1U/2U servers, switches, storage enclosures, telecommunications equipment, industrial PCs, controls and instrumentation equipment.
Providing up to 200A per linear inch and a low contact resistance of just 0.6mΩ per contact within a compact design of just 7.5mm in height, these power contacts and housings are made for demanding AC and DC power distribution applications. Produced in a variety of configurations to serve multiple applications, the HPCE connectors include integrated guide features to enable ‘blind-mating’. This provides easy facilitation of easy connectivity and precise alignment.
The BTB connectors feature a highly ventilated housing design in order to enhance heat dissipation. Increasing the reliability of the end equipment, this is a crucial feature in server and data storage applications since it can help to avoid any potential overheating issues. The robust design also includes touch-proof safety features that are UL/IEC 60950 compliant.
Michael Blanchfield, Portfolio Director, Power Solutions, FCI, commented: “Following the success of our single-piece HPCE solution, we developed a two-piece connector solution to serve a wider range of applications. One of the key characteristics of the new connector is the ability to reduce contact resistance and minimise energy loss. We are confident the HPCE Board-to-Board connectors will meet many of our customers’ demands for increased reliability and energy efficiency in miniaturized power connectors.”
Offering unparalleled power and signal density in a miniaturised board-to-board platform, samples of the HPCE BTB connectors are available now.