SEGGER brings app-style extensibility to embedded devices with emApps launch Design 2 December 2025 byNews Desk
ODU-MAC Black-Line Compact Class: Mass interconnect extension Test & Measurement 2 December 2025 byNews Desk
Navitas expands SiC line-up with new 3300V and 2300V MOSFETS aimed at AI power and grid infrastructure Power 2 December 2025 byNews Desk
STMicroelectronics extends highly integrated VIPerGaN family with 65W flyback converter in Power QFN Power 2 December 2025 byNews Desk
Higher loads, faster builds: six trends defining data centres in 2026 IndustrialNews & Analysis 2 December 2025 byNews Desk
HydroGNSS: UK leads ESA’s first ‘Scout’ climate mission into orbit Aerospace & DefenceNews & Analysis 2 December 2025 byNews Desk
Only photonics can satisfy AI’s appetite for compute power Artificial IntelligenceOptoelectronics 2 December 2025 byNews Desk
HPE simplifies and accelerates development of AI-ready data centres with secure AI factories powered by NVIDIA Artificial IntelligenceLatest 1 December 2025 byNews Desk
NVIDIA invests $2bn in Synopsys as pair launch drive to transform global engineering Design 1 December 2025 byNews Desk
Bourns adds 35-part numbers to its high power Multifuse PPTC family, giving designers elevated fuse performance options Power 1 December 2025 byNews Desk
GÖPEL electronic integrates boundary scan into Takaya Flying Prober Test & Measurement 1 December 2025 byNews Desk
Tandem Ventures harvests the design capability of Onshape to help save the world’s seagrass meadows Latest 1 December 2025 byNews Desk
Matter-compliant Bluetooth SoC in stock at Mouser Internet Of Things (IOT) 1 December 2025 byNews Desk
Rohde & Schwarz revenues rise 7.6% to top €3Bn News & AnalysisTest & Measurement 1 December 2025 byNews Desk
Infineon’s SECORA Pay M – new platform for fast and efficient payment and secured FIDO authentication Security 1 December 2025 byNews Desk
Flash-forward: predictions and trends for data storage in 2026 IndustrialMemory 1 December 2025 byNews Desk