Nihon Superior Co. Ltd. announces that President Tetsuro Nishimura will present two papers at the upcoming SMTA Pan Pacific Microelectronics Symposium, scheduled to take place February 14-16, 2012 at the Sheraton Poipu Resort in Kauai, Hawaii. The first presentation will be held during Session TA1, titled “Pb-Free Advancements” on Tuesday, February 14, 2012, and the symposium Keynote II will be held on Wednesday, February 15, 2012.
The topic of the Symposium Keynote II will be “Pushing the Limits of Lead-Free Soldering,” in which Mr. Nishimura will discuss the wider issues involved in converting the global electronics industry to lead-free soldering technologies. During the presentation of the paper, titled “Tin-Copper-Nickel-Germanium – A Case Study in Lead-Free Implementation,” Mr. Nishimura will describe how he responded to the Japanese electronics industry’s need for a high-performance lead-free solder that was more cost-effective than the tin-silver-copper alloy that was then proposed as the only option.
Both presentations are based on Mr. Nishimura’s experiences in developing a lead-free solder that has earned widespread technical recognition and commercial success as well as establishing a Japanese company in the global market.