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Nihon Superior Company Limited

Nihon Superior Company Limited Articles

Displaying 1 - 20 of 45
News & Analysis
1st November 2023
Nihon Superior and FCT Solder extend partnership

Nihon Superior and FCT Solder are delighted to announce the renewal of their longstanding partnership.

Design
5th January 2023
Nihon Superior launches Ag-free SAC305 replacement

With its rule-breaking wave solder alloy, SN100C, Nihon Superior earned global recognition as an innovator in lead-free solder formulation.

Sensors
3rd November 2018
Superior sensor technology revolutionises pressure sensors

Superior Sensor Technology launched the company with the introduction of NimbleSense, a breakthrough, application specific, pressure sensor technology for industrial, medical and automotive applications. The NimbleSense architecture is an integrated platform combining advanced piezoresistive sensing elements, analog signal path, processing intelligence and proprietary integration techniques to create the industry’s highest performing sensor...

Component Management
28th March 2018
Nihon Superior rebrands SN100C alloy with new logo

Nihon Superior Co. Ltd. has introduced its new SN100C logo. The logo replaces the originally used SN100C logo and will be used worldwide to brand this important alloy. The announcement was made during the recent IPC APEX EXPO in San Diego. The three-ring logo has significance in its meaning for the representation of Sn-Cu-Ni, the fundamental composition of the SN100C solder alloy. Sn is represented by the red “S”, Ni by the blue ...

Analysis
19th February 2017
Nihon Superior wins NPI award

Nihon Superior has been awarded a 2017 NPI Award for its SN100CV P506 D4 Lead-Free Solder Paste. The award was presented to the company’s President, Tetsuro Nishimura during the IPC APEX EXPO.

Events News
10th January 2017
Solder pastes address improvements in reliability

Exhibiting in Booth 2610, Nihon Superior will be at the 2017 IPC APEX EXPO, taking place 14th-16th February at the San Diego Convention Center in California. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products.

Component Management
31st August 2016
New solder paste at SMTA International

Nihon Superior is to exhibit at SMTA International and will showcase its SN100CV P506 D4 lead-free alloy which provides faster wetting and increased spreadability over SAC305 - which is beneficial in wave soldering and hand soldering applications as well as in reflow.

Component Management
16th February 2016
Nihon Superior at IPC APEX EXPO

Nihon Superior is to exhibit at the IPC APEX EXPO and will showcase the SN100C lead-free alloy - proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow

Component Management
4th January 2016
Nihon Superior at NEPCON Japan

Nihon Superior Co. Ltd will exhibit at NEPCON Japan, scheduled to take place Jan 13-15, 2016 at the Tokyo Big Site. During the show, the company will showcase newly developed products that offer improvements in reliability, thermally stable joining, and lead-free die attach.

Analysis
9th October 2015
Nihon Superior's president voted "best inventor"

Advanced joining material supplier, Nihon Superior, has told us that Tetsuro Nishimura was awarded Best Inventor by SMT Today Magazine during the recent SMTA International Conference & Exhibition. The award recognises an individual or team whose innovation/s have been used to drive improved efficiency, productivity and performance within the electronics manufacturing industry.

Events News
16th September 2015
Nihon Superior celebrates 50th anniversary at SMTAI

Nihon Superior will exhibit in Booth 419 at SMTA International, scheduled to take place from 27th September to 1st October, 2015 at the Donald Stephens Convention Centre in Rosemont, IL. This year, Nihon Superior will celebrate its 50th anniversary since first introducing joining materials to the market. The most well-known solder; SN100C has seen its 15th anniversary and its usage is still expanding. The reliability of SN100C has been proven in ...

Events News
27th January 2015
Lead-free eutectic solder paste on show at IPC APEX

Nihon Superior has announced that it will exhibit in Booth 739 at the IPC APEX EXPO, scheduled to take place 24th to 26th February 2015, at the San Diego Convention Centre, California. Company representatives will showcase the SN100C P506 D4 lead-free, no-clean solder paste and Alconano Nano-Silver paste.

Events News
2nd September 2014
Keith Sweatman to present paper for SMTAI Technical Session

Nihon Superior's Keith Sweatman will present a paper titled ”Enhancing the Impact Properties of Tin-Copper and Tin-Copper-Nickel Lead-Free Solders with Trace Additions of Zinc, Indium and Gold” at SMTAI 2014. The paper is due to be presented during Session MFX6, titled ”Alternate Alloys”, on Wednesday 1st October from 2-3pm in Room 49 at the Donald Stephens Convention Center in Rosemont, IL. 

Events News
27th August 2014
Latest solder technology developments on show at SMTAI

At SMTA International, September 30th to October 1st in Illinois, USA, Nihon Superior will exhibit in Booth #410. The company will have representatives showcasing a range of product solutions for current challenges faced by the electronics industry, including lead-free die attach, void minimisation, environmental protection and process yields.

Analysis
30th July 2013
Nihon Superior will appear at NEPCON to address Soldering challenges

Nihon Superior will showcase in Stand 2B20 at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China. Company representatives will showcase a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, including lead-free die attach, void minimization, environmental protection, and process yields.

Tech Videos
25th September 2012
SN100C Solder Wire Features in University of Queensland Demonstration Video

Nihon Superior and the University of Queensland have long been partners in research directed at understanding how lead-free solders behave with a view to optimizing their performance for users. As part of this relationship Nihon Superior has regularly supplied flux-cored solder wire to the laboratory of the University’s School of Information Technology and Electrical Engineering for use by students and researchers in the assembly of the electro...

Analysis
18th September 2012
Nihon's Keith Sweatman to Present at SMTA International

Nihon Superior has announced details of its participation in the Technical Program of SMTAI 2012, which is being held in the Walt Disney World Dolphin Hotel, Orlando, FL, from October 14-18, 2012. The paper, “Optimizing Solder Paste for Void Minimization with Vacuum Reflow” will be presented in Session SMT7, 4-5:30 p.m. on Wednesday, October 17 in the Asia 2 meeting room.

Analysis
28th March 2012
Nihon Superior Shanghai to Exhibit at NEPCON China 2012

Nihon Superior Shanghai Co. Ltd. will showcase a new and expanded range of products based on its SN100C silver-free, lead-free solder at the upcoming NEPCON China 2012 exhibition in Shanghai. Included in this expanded product range will be the first of Nihon Superior’s new SN100C Advantage SeriesTM alloys, SN99CN in the form of spheres and the solder paste SN99CN P502 D4.

Analysis
28th March 2012
Nihon Superior Issues Reassurance of Product Radiation Levels Since the Japanese Earthquake

Nihon Superior Co. Ltd., announces that it is able to report measurements of radiation levels to provide reassurance that products shipped from its distribution center in Toyanaka City, Osaka do not present any risk to its customers.

Analysis
29th February 2012
The Newest Addition to Nihon Superior’s SN100C Lead-Free Solder Series Wins a 2012 NPI Award

Nihon Superior Co. Ltd. announces that it has received a 2012 NPI Award in the category of Soldering Materials for its SN100C (551CT) Flux-Cored Solder Wire. The award was presented to the company’s President, Tetsuro Nishimura, during a ceremony that took place on Tuesday, February 28, 2012 at the San Diego Convention Center in California.

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