Guide outlines AdvancedTCA, MicroTCA and AdvancedMC packaging solutions

Electronics packaging specialist Schroff, one of the leading members of the PICMG consortium, has compiled a new 88-page guide to the AdvancedTCA, MicroTCA and AdvancedMC open computing specifications. These emerging standards were originally developed for the telecoms market and are now gaining momentum in other industry sectors where high availability and high data transfer rates are key requirements.

Illustrated throughout by line drawings and colour photographs, the new guide provides a detailed introduction to the three standards, as well as presenting Schroff’s comprehensive range of associated packaging solutions.

These include AdvancedTCA complete systems and accessories, AdvancedMC carriers and, for MicroTCA applications, a variety of complete systems, development systems, subracks, backplanes and power supply solutions.

A number of pages are devoted to various cooling systems based on air and air/water concepts for subrack and cabinet installation, and the guide is rounded off with information about product support services grouped under the ServicePLUS banner.

Keep Up to Date with the Most Important News

By pressing the Subscribe button, you confirm that you have read and are agreeing to our Privacy Policy and Terms of Use
Previous Post

Electronics Industry Embraces Synplicity’s Confirma Platform for ASIC Verification

Next Post

Peregrine Expands PLL Frequency Synthesizer Portfolio