Samtec AcceleRate HD ultra-dense mezzanine strips feature a low-profile 5 mm stack height, slim 5mm width, and a 0.635mm pitch.
These micro interconnects are super dense with up to 240 total inputs/outputs (I/Os).
The four-row design allows 10 to 60 positions per row. Samtec AcceleRate HD header and socket connectors are PCIe Gen 5 compatible, support 56Gbps PAM4 (28Gbps NRZ) applications, and feature an Edge Rate contact system that is optimised for signal integrity performance.
The solder ball technology self-aligns for simplified processing while the open-pin-field design offers grounding and routing flexibility.
The strips are compatible with Samtec UMPT/UMPS ultra micro-power connectors for flexible two-piece power/signal solutions.
Applications include high-density board-to-board and backplane interconnects.
