Additionally, the company will discuss its microelectronics assembly services, which include package assembly, sealing and testing. With more than 40 years of experience in high-reliability hybrid and RF technologies, NEO Tech has emerged as North America’s largest microelectronics assembly services provider.
During the symposium, NEO Tech will feature a range of its LTCC, HTCC and hybrid substrates, and microelectronics packaging technologies.
The company’s microelectronics facilities produce products and assemblies for a wide variety of OEMs in medical, telecommunications, and defense markets. The microelectronic industry faces the challenge of controlling costs and risk while ensuring reliability, and the company has thrived by offering customers an unmatched understanding of materials, production equipment, standardized processes, and defect-elimination approaches.