According to the company, the main advantage of THERM-A-GAP MCS30 thermal filler pads is that their cross-linked soft gel structure provides superior performance and long-term thermal stability over conventional high modulus thermal pads. Specifically, Chomerics has designed the thermal interface material for use in applications requiring low compression forces.
Ease-of-handling and application are also important features of this advanced product range, hence the presence of two natural tack sides. Furthermore, the inherent softness of THERM-A-GAP MCS30 facilitates conformance to irregular surfaces.
Another point of note is that Chomerics has developed a product which not only exhibits superior long-term physical and thermal reliability, but demonstrates resistance to the thermal oxidation degradation associated with continuous application temperatures of up to 200°C.
THERM-A-GAP MCS30 comes in standard thicknesses of 0.5 to 5.0mm, although custom thicknesses are available on request. Product features include thermal conductivity of 3W/m-K@20psi, electrical isolation, low outgassing (0.06%) and low silicone extractable properties (0.25%). It is RoHS compliant and offers a 24-month shelf life from date of manufacture.