Thickness offerings range from 50nm to more than 2.5μm. Furthermore, these options facilitate assembly by wire bonding, conductive adhesive (epoxy bonding) as well as most soldering attachment methods while ensuring improved long term performance and reliability.
Reggie Phillips, Product Line Manager, KEMET, commented: “KEMET’s new gold termination options further the company’s commitment to supporting customers with increasingly higher temperature requirements. Our patented base metal electrode dielectric technology combined with gold termination translates to a lead-free, RoHS and REACH compliant product capable of continuous and reliable operation up to 200°C.”