Parallel to the exhibition the SMT Hybrid Packaging conference and tutorials provide hands-on information about relevant topics ranging from the production of electronic assemblies via design to quality assurance. The deadline for the submission of abstracts is 5th October 2015.
SMT Hybrid Packaging is the international meeting place for products and services along the entire value chain of electronics manufacturing, from research via materials and components to manufacturing and test equipment. In two half-day sessions, the conference analyses cutting-edge topics of modern system integration and its applications. The tutorials provide basic and technical knowledge with a practical focus.
