The F7000 EB lithography system delivers high throughput and can create nano-patterns on wafers with 1X-nm resolution. Direct-write technology is suitable as a design tool for research and development as well as on system LSI production lines, where small-lot-multiple-type devices are produced.
The E3310 and E3640 MVM-SEM systems enable real-time, 3D measurement and imaging. For tri-gate processing, the E3310 MVM SEM offers high efficiency for volume production. The E3640 system delivers the industry’s best pattern-measurement capability and high throughput for applications including standard photomasks, EUV photomasks and NIL templates.
The E5610 DR-SEM is designed for reviewing and classifying ultra-small defects in next-generation photomasks and blanks. The system offers highly stable, fully automatic image capturing with the long-term operational stability and reliability essential for manufacturing analyses of critical masks.