This July, Electronic Specifier’s Managing Editor, Paige Hookway, takes a look at the top 5 power products released in July 2026.
Allegro MicroSystems integrate a wheel-speed sensor
Allegro MicroSystems introduced the A81415, the industry’s first ASIL-D-certified Power Management IC (PMIC) to integrate a wheel-speed sensor interface. The new device provides electromechanical braking (EMB) designers with a substantially simplified, single-chip power and sensing foundation for next-generation brake-by-wire systems.
Brake-by-wire is fast becoming a foundational chassis technology in software-defined vehicles. But while much of the automotive industry’s design focus is on centralising compute platforms, the physical act of stopping a vehicle happens at the wheel. This location places a hard set of demands on corner module electronics to deliver fail – operational power and accurate wheel-speed data in tight spaces that are vibration- prone and thermally stressed – all while meeting the highest functional safety bar.
AmpStack packaging: a leap forward in MOSFET power density
Alpha and Omega Semiconductor Limited (AOS) has introduced its AOPL66801 80V MOSFET in a half-bridge configuration available in a state-of-the-art DFN6x5 AmpStack MOSFET package. This breakthrough packaging technology enables high-density designs for various power conversion applications, ranging from next-gen Megawatt AI factories to everyday power tools.
Designed to support high power-density requirements, AOS’s new advanced packaging uses vertically stacked die technology with two MOSFETs connected as a high-side and low-side MOSFET, forming a half-bridge. This configuration effectively increases power density and maximises available PCB space compared to a two DFN5x6 discrete MOSFET solution. The AOPL66801 also features an optimised clip design for the switch node connecting the two MOSFETs, which minimises parasitic inductance between the high-side and low-side MOSFETs. Compared to a standard discrete solution, the AOPL66801 minimises parasitic inductance on the PCB, reducing phase-node voltage ringing and decreasing stress on the MOSFET.
ROHM launches 600V super junction MOSFETs
ROHM has developed a new line up of 600V Super Junction MOSFETs, the R60xxXNx and R60xxWNx series.
In the data centre and industrial equipment fields, power demand continues to increase as processing loads grow, driving strong demand for higher power supply efficiency to reduce both power consumption and heat generation. At the same time, as applications become smaller, power supply circuits must achieve higher power density and space savings while delivering higher output within limited space.
To meet these requirements, Super Junction MOSFETs must deliver even lower loss and improved thermal performance, driving the rising adoption of surface-mount packages with excellent heat dissipation. In addition, from the perspective of reducing procurement risk, support for multi-sourcing and securing second sources have become essential in recent years, making high compatibility with existing standard products an important requirement.
Smart stepper motor controller and driver support up to 4.25 ARMS
Authorised distributor DigiKey is now stocking Analog Devices’ TMC5262 fully integrated single-axis stepper motor controller and driver.
It is designed for high-performance motion control applications requiring compact size, high efficiency, and extensive diagnostics.
The device integrates dual 65 V power H-bridges, internal current sensing, a configurable motion controller, and SPI communication, reducing external component count while simplifying system design.
Toshiba expands 40V AEC-Q101 MOSFET lineup
Toshiba Electronics Europe has launched the XPJ1R504PB, an automotive-compliant 40V, 120A N-channel power MOSFET housed in the S‑TOGL package, expanding its lineup for 12V systems. Target applications include inverters, semiconductor relays, load switches, and motor drives. By adding this 40V MOSFET to its existing lineup in the S‑TOGL package, which includes the XPJR6604PB and XPJ1R004PB, Toshiba has expanded its product options to meet a range of applications and performance requirements.
In recent years, with the advancement of electrification in automotive equipment, the adoption of inverters and motor drives has been expanding, driving higher output and efficiency. To address these trends, MOSFETs must deliver both low power loss and high heat dissipation. The XPJ1R504PB, featuring the S-TOGL package, enables compact, high-density mounting and excellent thermal performance, thereby reducing the size of automotive equipment and improving efficiency.
