The latest in embedded system design from TI: part two

The latest in embedded system design from TI: part two The latest in embedded system design from TI: part two

In the second instalment of our four-part series on the latest in embedded system design from Texas Instruments, we explore a broad range of innovations spanning real-time microcontrollers, mixed-signal MCUs, development tools, and connectivity solutions.

Whether you’re optimising power electronics, shrinking form factors, or hardening your designs against cyber threats, TI’s expanding portfolio has something to offer.

TMS320F280013x real-time microcontrollers

The TMS320F280013x (F280013x) is a member of the C2000 real-time microcontroller family of scalable, ultra-low latency devices designed for efficiency in power electronics.

The real-time control subsystem is based on TI’s 32-bit C28x DSP core, which provides 120 MHz of signal processing performance for floating- or fixed-point code running from either on-chip flash or SRAM. The C28x CPU is further boosted by the Trigonometric Math Unit (TMU), speeding up common algorithms key to real-time control systems.

The F280013x supports up to 256KB (128KW) of flash memory. Up to 36KB (18KW) of on-chip SRAM is also available to supplement the flash memory.

High-performance analog blocks are integrated into the F280013x real-time microcontroller (MCU) and are closely coupled with the processing and PWM units to provide optimal real-time signal chain performance. Fourteen PWM channels enable control of various power stages from a 3-phase inverter to power-factor correction and other advanced multilevel power topologies.

TQ System on modules (SOMs) for TI processors

Thomas Mauer from TI’s industrial marketing team visits with TQ-Group to discuss their system on modules (SOMs) and how they simplify designs for TI processors.

Watch the video to learn how to use the TQMa67xx for image processing.

MSPM0G350x mixed-signal microcontrollers with CAN-FD interface

MSPM0G350x microcontrollers (MCUs) are part of the MSP highly integrated, ultra-low-power 32-bit MCU family based on the enhanced Arm Cortex-M0+ 32-bit core platform operating at up to 80MHz frequency.

These cost-optimised MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40 to 125°C, and operate with supply voltages ranging from 1.62 to 3.6V. The MSPM0G350x devices provide up to 128KB embedded flash program memory with built-in error correction code (ECC) and up to 32KB SRAM with hardware parity option.

Think big with the world’s smallest microcontroller

The demand for smaller products with enhanced functionality challenges design engineers to pack more features into compact spaces while still reducing cost. TI created the world’s smallest microcontroller, empowering engineers to meet these challenges. At just 1.38mm², it packs integration and performance into a package 2/3 the size of competing devices. From personal electronics to medical wearables and more, discover how you can design compact, powerful and cost-effective solutions.

CCStudio development ecosystem

Why choose CCStudio development ecosystem?

The CCStudio development ecosystem is a unified suite of free, high-quality development tools with integrated generative AI to accelerate your embedded development. Using simple language and industry-standard agents and models fed with TI’s expansive resource library, you can develop applications faster – regardless of expertise level – while maintaining the reliability and performance standards you expect from TI.

MSPM0C110x, MSPS003 mixed-signal microcontrollers

MSPM0C110x microcontrollers (MCUs) are part of the MSP highly-integrated ultra-low-power 32-bit MCU family based on the enhanced Arm Cortex-M0+ core platform operating at up to 24MHz frequency. These cost optimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40 to 125°C, and operate with supply voltages from 1.62 to 3.6V.

The MSPM0C110x devices provide up to 16KB embedded flash program memory with 1KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy from -2 to +1.2%, eliminating the need for an external crystal. Additional features include a 1-channel DMA, CRC-16 accelerator, and a variety of high performance analog peripherals such as one 12-bit 1.5Msps ADC with VDD as the voltage reference, and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as one 16-bit advanced timer, two 16-bit general purpose timer, one windowed watchdog timer, and a variety of communication peripherals including one UART, one SPI, and one I2C. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, smart card, SMBus, and PMBus.

Highly integrated, low-cost MCUs for industrial and automotive systems

TI’s Arm-Cortex-based 32-bit microcontrollers (MCUs) offer you a scalable portfolio of high-performance and power-efficient devices to help meet your system needs. Bring capabilities such as functional safety, power efficiency, real-time control, advanced networking, analytics and security to your designs. Accelerate your development with TI’s industry-leading evaluation tools, reference designs and development resources.

Reduce system design time and cost with flexible RS-485 transceivers

RS-485 has been the most used wired communications interface in industrial applications for more than two decades now. Balanced differential signalling of RS-485 allows for rejection of common mode noise and facilitates communications over long distances in noisy industrial environments. RS-485 is a common communications port in most industrial applications such as factory automation, protection relay, solar inverter, energy meter, motor drives and building automation.

Download the technical whitepaper.

Solving key wireless connectivity cybersecurity challenges with low-power wireless MCUs

With wireless connectivity innovations, the ability to connect devices has now expanded to everyday electronics, bringing intelligence to homes and vehicles. More intelligence means more functionality and features: the ability to remotely monitor and control a device, augmented abilities with Cloud computing, and faster software updates.

However, as our world becomes more connected, it’s crucial to protect these products from intrusion. From securing stored personal or sensitive application data to protecting data in transit and physical device security, engineers implementing wireless connectivity in their designs need to address system-level security capabilities earlier in the design process, while also meeting the relevant requirements of cybersecurity standards and regulations.

Download the technical article.

Achieving smoother, quieter motor performance with highly integrated real-time control MCUs

Consumers expect their appliances to run more quietly and exhibit greater mechanical and electrical durability. This holds true even for end equipment such as handheld tools, washing machines, fans, and heating, ventilation and air-conditioning (HVAC) units.

Historically, the way to improve acoustic performance, dynamic behaviour and system longevity has been to improve the mechanical design, implement new materials, or employ thermal management or advanced control strategies. Many of these control strategies require implementations that span multiple devices: one for processing, another for sensing, and additional components for signal conditioning or protection. While technically effective, these implementations can introduce tightly coupled dependencies across hardware and software, increase latency and jitter, and require effort to integrate and tune. As a result, the challenge has shifted from meeting system performance targets to meeting them without increasing system complexity or cost.

Download the technical article.

From the processing power of the C2000 family to the world’s smallest microcontroller, this instalment underscores TI’s commitment to helping engineers do more with less – less space, less power, and less development time. As we continue through this series, we’ll keep uncovering the tools and technologies helping embedded designers stay ahead of an ever-evolving landscape.

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