MediaTek announced it is among the first companies to partner with TSMC to develop a chip featuring the advanced N2P process, taping out MediaTek’s flagship SoC with volume production slated for late next year.
This marks a milestone in the partnership between MediaTek and TSMC, as a long-standing collaboration continues to bear fruits: high performance, power-efficient chipsets for customers in applications such as flagship mobile, compute, automotive, data centre, and more.
TSMC’s 2nm technology is the first to adopt nanosheet transistor structure, and N2P reflects the next evolution in the 2nm family, set to deliver improved performance and power efficiency. The first chipset utilising the new TSMC N2P process is expected to be available in late 2026.
Compared to the current-generation N3E process, N2P users can expect to see as much as an 18% increase in performance at the same power, an approximately 36% power reduction at the same speed, and a 1.2x increase in logic density.
“MediaTek’s innovations powered by TSMC’s 2nm technology underscores our industry leadership, as we continue to push forward with the most advanced semiconductor process technologies available for a variety of devices and applications,” said Joe Chen, President of MediaTek. “Our long history of close collaboration with TSMC has led to incredible advancements in solutions for our global customers, offering the highest performance and power efficiency from the Edge to the Cloud.”
“N2P represents a significant step forward in the nanosheet era for TSMC, demonstrating our relentless dedication to fulfilling our customers’ needs – tuning and improving our technologies to deliver energy-efficient computing capability,” said Dr. Kevin Zhang, Senior Vice President of Business Development and Global Sales and Deputy Co-COO of TSMC. “Our ongoing collaboration with MediaTek focuses on maximising enhanced performance and power capabilities across a wide range of applications.”
