Show attendees are invited to visit the company in Hall A4, Stand 207 to learn more about Microsemi’s:
– New SmartFusion2 system-on-chip (SoC) field programmable gate array (FPGA) family with breakthrough capabilities in security, reliability and low power;
– Comprehensive solutions portfolio for aviation and space applications;
– Security product offering cryptography solutions, TRRUST-Stor solid state drives (SSD), intellectual property (IP) and firmware;
– Ultra low-power radio for medical and energy harvesting applications;
– RF integrated solutions portfolio; and
– Power-over-Ethernet subsystems and ICs.
WHO:
Electronic developers, software engineers, researchers, development executives, production representatives and others interested in the latest technologies related to the electronics industry will be in attendance at the conference.
WHEN:
Microsemi’s exhibition booth will be open Tuesday, Nov. 13 through Friday, Nov. 16 during show hours.
WHERE:
Microsemi will be in Electronica in Hall A4, Stand 207, which will be held at the New Munich Trade Fair Centre in Munich, Germany.