Engineers frequently are challenged to find ways to reduce manufacturing costs. In the case of an SMT process, these cost-saving measures typically focus on identifying less expensive materials and reducing scrap, approaches that often overlook possible improvements in the operating efficiencies of the reflow oven itself. Dimock’s presentation will highlight some methods and tools that can be used to lower energy costs of the reflow oven while maintaining profiles that are within the solder manufacturer’s reflow specifications.
Dimock is the manager of Process Technology at BTU International. His extensive experience in thermal processing includes positions at Corning, General Electric and Sylvania. Additionally, he has authored numerous articles on lead-free processing and process control.