KIC will present three examples of reflow related defects (bridging, tombstoning and solder balling), and how they are easily and efficiently solved as per a solder paste manufacturer’s recommendations. KIC explains how to easily identify with a profile if the defect is reflow-related.
A Defect Mitigation Guide will be provided, covering eight common reflow-related defects. KIC also will discuss how to avoid or prevent process-related defects from occurring, both for the reflow oven and the wave soldering process. For example, the importance of developing a deep in specification thermal process will be explained, in addition to which thermal profiling tooling and software can be used to achieve excellent defect free results.
Mr. Lopez is a Sales and Service Engineer for Mexico with KIC. He has been active in the Mexico marketplace for 15 years with a focus on reflow and wave soldering processes.