Spring probe brings longer life, improved MTBF
The LFRE-39 spring probe from Everett Charles Technologies (ECT) completes its portfolio of products for lead-free test applications. LFRE-39 features ECT’s LFRE plating and is designed to meet fine pitch requirements down to 39 mil (1.0 mm). The LFRE-39 fully meets the demanding requirements of high volume production in-circuit and functional test.
LFRE plated probes are field proven to provide enhanced performance in high volume production test environments. LFRE probes are less prone to solder transfer and tip wear due to their exceptional hardness.
Lead free solder and OSP (Organic Solderability Preservatives) treated copper pads typically present a harder or more abrasive contact surface causing excessive plating and probe tip wear.
Customers report that LFRE plating has demonstrated longer life and MTBM (mean time between maintenance) on their most challenging applications. LFRE plating is significantly harder than typical gold plating.
LFRE has a hardness range of 550 to 650 Knoop which is about 3 to 4 times harder than standard gold. This makes the probe tips more durable and less susceptible to solder and material transfer.
LFRE plated probes are the best solution to contact RoHS compliant boards and OSP boards.
Lead free plating is featured on ECT’s industry standard PogoPlus LFRE series, Metrix, and on LFLT Long Travel probes. With the addition of LFRE-39, ECT’s proprietary plating is now available on a wide range of pitch options.
Tony DeRosa, Product Manager, explains: “In head to head testing with traditional gold plated probes, LFRE plated probes offer lower and more consistent resistance. LFRE probes have also outperformed gold plated probes in high volume production test applications by 3 to 5% first pass yield improvement. With LFRE-39 we can provide a reliable test probe solution for fine pitch lead-free PCBA test fixture applications.”