The 3D AOI system provides measurement of components with a height range from 0-20mm, achieving 1-micron height resolution, a false call rate of <100ppm with 0 escapes, and a positioning system 50% faster than Saki's previous 3D machine. The camera and lighting systems capture extremely clear, detailed images with no shadowing for inspection of the most difficult defects, such as lifted leads, tombstones, reversed polarity, and height variations.
Saki will also demonstrate its 3D automated solder paste inspection system, which uses both a 2D and 3D LCoS imaging system and offers closed-loop process functionality, pad-based warpage compensation, and measurement performance specifically optimized for printed solder paste. “Saki is the industry innovator that revolutionized 2D line-scan AOI over 21 years ago,” said Satoshi Otake, General Manager, SAKI America. “We offer a complete 3D lineup of SPI, AOI, and AXI with systems installed globally. All Saki’s 3D systems share the same software and graphical user interface for easier programming and operation.