After image capturing from different directions and succeeding reconstruction, OptiCon X-Line 3D provides the opportunity to analyse both the top and bottom sides of the boards and all layers in between layer by layer.
Initially, each BGA solder ball is localised in x/y-direction as well as z-direction. Subsequently, relevant parameters of each solder joint are determined in three layers. By comparing these measured values open solder joints and wetting defects can de safely detected. Additionally, voids can be determined in size and their z-position within a solder joint. Naturally, the system is able to detect solder connections at IC pins and 2-pin components as well as THT components.
The OptiCon X-Line 3D is unrivalled worldwide by utilising the revolutionary GigaPixel image technology. A real-time multi angle image recording is the basis that enables a test speed of 40cm²/s for full 3D PCB capturing. Integrated reconstruction methods, based on digital tomosynthesis, allows defined evaluation of the board’s single layers.