With proprietary micro-focus source technology, the XT V 160 is specifically designed for use in production lines and failure analysis laboratories. Real-time X-ray allows users to intuitively navigate complex printed circuit boards and electronic components and quickly trace defects. In automated inspection mode, samples can be inspected at highest throughput. Lectronics has gained the ability to perform batch AXI – this new system will allow the company to automatically inspect an entire printed circuit board assembly.
The X.Tract system uses laminography technology (taking image slices of a particular object) and then reconstructs those slices for a finished, whole 3D image. This will allow Lectronics’ engineers to get a detailed view of component connections that are typically difficult to see in 2D X-ray systems; for example, stacked BGAs or complex mixed technology printed circuit board assemblies. The 360 view within X.Tract also supports the isolation of individual image layers enabling detailed inspection of each layer, which will allow Lectronics’ technicians to specifically hone in and inspect any suspected areas of concern.