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Texas Instruments brings you the latest in Automotive ADAS

5th April 2024
Paige West
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Here, you’ll find a selection of the latest news, products, and articles from Texas Instruments focused on the Automotive ADAS industry.

76-81GHz FMCW satellite Radar-on-Chip sensor

The AWR2544 is a single-chip mmWave sensor composed of a FMCW transceiver. The device is capable of operation in the 76 to 81GHz (EHF) band, includes radar data processing elements, and a rich set of peripherals for in-vehicle networking. AWR2544 provides customers with an additional Launch on package (LOP) antenna feature which facilitates the attachment of antennas directly on to the package. The AWR2544 is built with TI’s low-power 45 nm RFCMOS process and enables unprecedented levels of integration in a small form factor and minimal BOM. The AWR2544 is designed for low-power, self-monitored, ultra-accurate radar systems in the automotive space.

Find out more.

Download the datasheet.

Flyback converter design considerations

The many virtues of flyback converters include being the lowest-cost isolated power converter, easily supplying multiple output voltages, a simple primary-side controller and power delivery of up to 300W. Flyback converters are used in many offline applications from televisions to phone chargers as well telecommunications and industrial applications. Their basic operation can appear intimidating and the design choices are many, especially for those who have not designed one before. Let’s look at some of the key design considerations for a 53VDC to 12V at 5A continuous-conduction mode (CCM) flyback.

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Enabling satellite architecture with AWR2544 radar sensors

Satellite architecture is the emerging automotive radar architecture that enables centralised data processing. TI’s AWR2544, engineered using the innovative launch-on-package technology, is the first radar-on-chip in the market designed specifically for this architecture.

Watch the video.

AWR2544 Single-Chip 76-81GHz FMCW Radar SoC

The AWR2544 is a single-chip mmWave sensor composed of a FMCW transceiver. The device is capable of operation in the 76 to 81GHz (EHF) band, includes radar data processing elements, and a rich set of peripherals for in-vehicle networking. AWR2544 provides customers with an additional Launch on package (LOP) antenna feature which facilitates the attachment of antennas directly on to the package. The AWR2544 is built with TI’s low-power 45 nm RFCMOS process and enables unprecedented levels of integration in a small form factor and minimal BOM. The AWR2544 is designed for low-power, self-monitored, ultra-accurate radar systems in the automotive space.

Find out more.

AWR2943/44 Single-Chip 76- and 81GHz FMCW Radar Sensor

The AWR294x is a single-chip mmWave sensor composed of a FMCW transceiver, capable of operation in the 76- to 81-GHz band, radar data processing elements, and peripherals for in-vehicle networking. The AWR294x is built with TI’s low-power 45-nm RFCMOS process and enables unprecedented levels of integration in a small form factor and minimal BOM. The AWR294x is an ideal solution for low-power, self-monitored, ultra-accurate radar systems in the automotive space.

Download the datasheet.

AWR2943/44 Single-Chip 76 and 81GHz FMCW Radar Sensor

The AWR294x is a single-chip mmWave sensor composed of a FMCW transceiver, capable of operation in the 76 to 81GHz band, radar data processing elements, and peripherals for in-vehicle networking. The AWR294x is built with TI’s low-power 45nm RFCMOS process and enables unprecedented levels of integration in a small form factor and minimal BOM. The AWR294x is an ideal solution for low-power, self-monitored, ultra-accurate radar systems in the automotive space.

Read more.

LP8772x-Q1 three buck converters, one linear regulator and one load switch for mmWave radar sensors

The LP8772x-Q1 device is designed to meet the power management requirements of the AWR, IWR, and other MMICs in various automotive and industrial radar applications. The device has three step-down DC/DC converters, a LDO regulator, and a load switch. The LDO is powered externally and intended for supplying Ethernet device or any other device in the system. The load switch is intended to cut off the 3.3 V IO supply during the sensor sleep mode. The device is controlled by I2C communication interface and by enable signals.

Download the datasheet.

TPS6594-Q1 Power Management IC (PMIC) with 5 BUCKs and 4 LDOs for safety relevant automotive applications

The TPS6594-Q1 device provides four flexible multiphase configurable BUCK regulators with 3.5 A output current per phase, and one additional BUCK regulator with 2 A output current.

Download the datasheet.

DP83TG720S-Q1 1000BASE-T1 Automotive Ethernet PHY with SGMII and RGMII

The DP83TG720S-Q1 device is an IEEE 802.3bp and Open Alliance compliant automotive Ethernet physical layer transceiver. It provides all physical layer functions needed to transmit and receive data over unshielded/shielded single twisted-pair cables. The device provides xMII flexibility with support for RGMII and SGMII MAC interfaces.

Download the datasheet.

DS90UB935-Q1 FPD-Link III 3-Gbps Serializer With CSI-2 Interface

The DS90UB935-Q1 serializer is part of TI's FPDLink III device family designed to support highspeed raw data sensors including cameras, satellite RADAR, LIDAR, and Time-of-Flight (ToF) sensors. The chip delivers a high-speed forward channel and an ultra-low latency, bidirectional control channel and supports power over a single coax (PoC) or STP cable. The DS90UB935-Q1 features advanced data protection and diagnostic features to support ADAS and autonomous driving. Together with a companion deserializer, the DS90UB935-Q1 delivers precise multi-camera sensor clock and sensor synchronisation.

Download the datasheet.

Advancements in mmWave Technology: Launch on Package for Automotive Radars

The landscape of automotive radar technology has undergone significant transformation, particularly in the realm of millimeter-wave (mmWave) semiconductor package technology and 3D waveguide antenna. From the initial use of microstrip patch antennas to the evolution towards 3D antennas, the quest for improved performance and efficiency has been relentless. TI’s Launch on Package (LoP) technology enables direct signal transmission from the package radiating element to the 3D antenna through the waveguide within the PCB, thereby enabling efficient electromagnetic signal transfer. In the current era, the spotlight is on LoP technologies, accompanied by sophisticated 3D waveguide antennas for providing better range and object detection.

Find out more.

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