Image sensor platform enables small footprint integration
The XGS 12000 and XGS 8000 devices in the new X-Class CMOS image sensor platform from ON Semiconductor provide 12.6 and 8.8MP (4k UHD) global shutter imaging for machine vision, ITS, and, broadcast applications. All ON Semiconductor image sensors and accessories are available from FRAMOS.
The 1" optical format XGS 12000 and the 1/1.1" optical format XGS 8000 enable compact 29x29mm² camera designs due to their small package size and low thermal profile.
These devices provide image quality with high quantum efficiency, broad dynamic range, and, low dark noise and dark current. A single camera design can support these first members of the X-Class image sensor platform. In addition, other resolutions based on the 3.2µm XGS pixel - and, additional X-Class products using different pixels - can be supported in the future:
Sibel Yorulmaz-Cokugur, Sensor Expert at FRAMOS, said: "ON Semiconductor's new XGS products provide superb performance in both dynamic range and dark noise for excellent picture quality. The small 3.2µm pixels enable high resolution at the 1" optical format node, supporting small camera footprints and easy application. The new XGS pixel and X-Class platform allow industrial imaging applications to advance with the flexibility needed to develop future-proofed designs."
The XGS 12000 offers high speed frame rates at 12-bit and up to 90fps at full resolution with a configurable HiSPi output covering three speed grades (24, 12, or 6 lanes). The XGS 8000 achieves up to 130fps at the same pixel depth. A companding mode at either 30fps with 6 lanes, or 60fps with 12 lanes is available for full resolution in the XGS 12000.
Higher frame rates and more efficient image capture can be achieved with programmable control, for up to eight Regions Of Interest (ROI). This flexibility in the available speed grades allows tailored performance to specific application requirements.
In addition to image performance, the XGS 12000 and XGS 8000 leverage the low power X-Class output architecture, enabling energy efficient designs.
This footprint compatible and scalable family simplifies both evaluation and integration support for short camera design times, and simplified logistics.
Product sampling begins in the second quarter of 2018, with mass production scheduled for the third quarter.