Ultra-cool heat sink family for high powered devices

The active heat sinks, dualFLOW and quadFLOW are designed for use on moderate to high component density PCBs, including 1U and 2U boards.

The sinks feature an aluminium or copper straight fin base, with a powerful blower on top. dualFLOW heat sinks draw air from two opposite directions, and quadFLOW sinks pull air from all four linear sides. The fast moving, high volume air helps maximise thermal performance on crowded boards and tight enclosures with insufficient airflow for passive cooling 

The passive (fanless) cooling solutions in ATS’ ultra-cool family are straight-fin heat sinks. They come in blue anodised aluminium or nickel-plated copper depending on thermal performance and weight requirements. They are ideal for systems with open airflow from front to back. Aluminium fins reduce the overall weight, while copper fins spread heat more efficiently for better thermal performance.

All ATS ultra-cool heat sinks fit standard Intel LGA 2011 sockets (Socket R) square and LGA 2066 sockets (Socket R4) commonly used in high-end cloud and edge server applications. An optional backing plate is available for applications other than the Intel LGA 2011 socket. The backing plate attaches beneath the PCB to avoid damaging the board when attaching the cooler.

The heat sinks can be securely attached using PEM screws and springs that provide firm contact to the hot component for optimum heat dissipation. The dualFLOW and quadFLOW cooling devices are available with a vapour chamber base in place of an aluminium or copper heat sink base.

All ATS ultra-cool heat sinks are available from ATS’ worldwide distribution network that includes Digi-Key Electronics and Mouser Electronics.