Cost reductions are realised with the reduced package size while maintaining compatibility in footprint to the DPAK package. The use of a high voltage CoolMOS in a SOT-223 package allows for a direct pin to pin replacement for DPAK in most designs, confirms the company. Almost no thermal limitations are given when using a DPAK footprint for SOT-223, it says.
The thermal behaviour of CoolMOS in the new package was assessed by placing the SOT-223 on a DPAK footprint. The temperature increased by a maximum of 3°C compared to DPAK.
The CoolMOS comes in 500, 600, 650 and 700V in the SOT-223 package.