The OSDZU3 AMD Zynq UltraScale+ ZU3 System-in-Package (SiP) from Octavo Systems is now being shipped by authorised distributor Mouser Electronics.
This SiP provides a fast and flexible way to develop systems around the AMD Zynq UltraScale+ MPSoC. The OSDZU3 SiP speeds up the development of CG devices for motor control, sensor processing and fusions, and traffic engineering; EG devices for flight navigation, data centres, and Cloud computing security; and EV devices for smart division, interactive displays, and video processing.
The OSDZU3 SiP enables developers to leverage the power of the UltraScale+ MPSoC while reducing design complexity.
It integrates a ZU3 AMD Zynq UltraScale+ MPSoC, two Infineon IRPS5401 PMICs, up to 2GB (16Gb) LPDDR4, QSPI Flash, EEPROM, two oscillators, and passive components into a single BGA package.
This comprehensive integration reduces the time it takes to develop applications by months, allowing users to go to market faster or add additional features to their products. The OSDZU3 SiP provides access to all ZU3 peripherals, including PCIe Gen2, USB3.0, SATA 3.1, and DisplayPort, among others.
In addition, the OSDZU3 SiP’s power modes allow designers to leverage all power modes supported by the ZU3.
Mouser also stocks the OSDZU3-REF (pictured), a full-featured development and evaluation platform for the OSDZUS SiP. This platform serves as a carrier board for the SiP and features an extensive set of peripherals, including USB 3.0, SATA, DisplayPort, Gigabit Ethernet, and LVDS touch-panel support.
It also offers a host of expansion options, including an FMC LPC header, PS and PL PMOD headers, and 100-mil headers, enabling users to easily customise and prototype.
