Use of SiC semiconductors helps designers to improve efficiency, reduce heat dissipation and save space in high-speed power switching designs. SiC power devices also offer stable operation over a wider temperature range than silicon alternatives – even at high voltages and currents.
With its 2nd gen SiC process, Toshiba has been able to reduce die thickness to develop SBDs with current densities around 1.5 times higher than 1st gen devices. In addition, the second generation SiC SBDs will offer higher non-repetitive forward surge current (IFSM) ratings.
The first products in the 2nd gen line-up will be 650V devices with current ratings of 4A (TRS4E65F), 6A (TRS6E65F), 8A (TRS8E65F) and 10A (TRS10E65F) in TO-220 2-pin and TO-220 isolated 2-pin packages named TRS..A65F. These diodes will be suited for high-speed switching power conversion designs including PFC schemes, PV inverters and UPS. Toshiba’s SiC SBDs can also be used to improve the efficiency of switching power supplies through the replacement of conventional silicon diodes.