This Special Presentation Session will include the DOE roadmap for automotive power electronics, technologies for thermal management and considerations for the systems integration of power building blocks. Attendees will gain insights into some of the key challenges and opportunities that lie ahead for new and emerging products that will be required to meet the future needs of the growing market for hybrid and electric vehicles.
Ernie Parker, Crane Aerospace & Electronics, and Doug Hopkins, State University of New York at Buffalo, co-chairs of the PSMA Special Presentation Session stated, “This Special Presentation Session provides valuable information on the packaging challenges facing this growing market segment and presents a timely and unique opportunity for attendees to interact with other professionals who have an active interest in this product space. We encourage people to register for APEC 2011 and make plans to attend the Session and to consider participating in other PSMA-sponsored meetings during the week.”