TKR74F04PB achieves a low RDS(on) in the automotive 3-pin SMD package market. Its low RDS(on) of typ0.6/max0.74 mohm was realised by combining Toshiba’s latest 9th generation trench MOS ‘U-MOS IX’ process with Toshiba’s TO-220SM(W) package. TO-220SM(W) has a wider and shorter source pin than conventional D2PAK (TO-263) packages and contributes to the PCB size reduction with a smaller foot print.
TKR74F04PB will conform to AEC-Q101 automotive level qualification requirements.