VINco E3 features SLC (SoLid Cover) technology, which combines an insulated metal baseplate and direct potting resin to achieve both high thermal and high power cycling capability. Equipped with the latest low-loss Mitsubishi gen 7 chips, this package also achieves high power density.
The VINco E3 line’s first release is the VINcoDUAL E3 half-bridge, with sixpack and PIM configurations to follow. First engineering samples may be sourced on demand from our usual channels.
