Typical applications requiring highest power density and efficiency are solar inverters, Uninterruptible Power Supply (UPS), battery charging, and energy storage.
The ultra-thin TRENCHSTOP 5 technology from Infineon allows higher power density in a smaller chip size. Thus, Infineon is the first to fit a 40A 650V IGBT together with a 40A diode in D2PAK housing. Compared to competing products in D2PAK, the new family offers a higher rating than any other product on the market, with other co-packed solutions delivering only 75% of the power.
The high power density of the new devices enables designers to upgrade existing designs, to develop new platforms with up to 25% higher power output or to reduce the quantity of power devices used in parallel and thus allowing more compact designs.
The unique co-packed 40A in D2PAK can be considered as an alternative to D3PAK or TO-247 used for surface mounting. This supports easy soldering, leading to fast and reliable assembly.