Power

High performance LDOs in 0.4mm ultra low profile packaging

6th March 2009
ES Admin
0
Torex Semiconductor’s XC6415 Series independently-controlled, dual output and XC6221 Series single output LDO voltage regulators are now available in the newly-developed USPN packaging to achieve higher density mounting. The height of the packages is just 0.4mm, making them one of the world’s lowest profile plastic mould package types with almost the same dimensions as Chip Scale Packages (CSPs). These extremely dense power devices are ideally suited for a range of battery-powered applications where small size and low power consumption are key design targets.
Devices in the both series are ideal for portable applications where space is at a premium such as mobile phones, portable games, cameras, portable AV equipment and PDAs. Already available in an ultra small USP-6C package and small SOT-25, the XC6415 device uses the USPN-6 package that measures just 1.3mm x 1.3mm x 0.4mm. In addition to USP-4, SOT-25 and SSOT-24 packages, the XC6221 Series single output LDO uses the even smaller USPN-4 package; measuring an incredible 0.9mm x 1.2mm x 0.4mm it is the smallest and thinnest package ever developed by Torex.

The XC6415 and XC6221 Series feature an ON/OFF function. Each output voltage of both series can be set internally by laser trimming in 0.05V increments within a range of 0.8V to 5.0V. By using the EN pin, devices in the XC6415 and XC6221 Series can be put into standby mode and the power supply current can be reduced to less than 0.1µA. This function enables the electric charge at the output capacitor (CL) to be discharged via the internal auto-discharge resistor, and as a result the VOUT pin quickly returns to the VSS level. In addition, the output stabilisation capacitor is compatible with low ESR ceramic capacitors.

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier