Conductive glue is a common method of mounting components in applications that demand reliability at high temperatures, particularly in automotive environments. It’s also used in applications that cannot be subjected to the heat of the solder paste mounting process, such as LCD panels, organic EL and LED displays, and CCD devices, which are particularly sensitive to high temperatures.
There are initially two parts in the NCG18 series, both available in 0603 case size. The NCG18XH103 has a thermal constant of 3380K and a resistance of 10k? at 25°C, while the NCG18WF104 has a thermal constant of 4200K and a resistance of 100k? at 25°C. Both dissipate 1.0mW/°C and feature operating temperature of -40 to +150°C.