Passives

Multilayer Chip Capacitors from Dengrove

4th September 2008
ES Admin
0
Dengrove has announced the introduction of high-value multilayer ceramic chip capacitors of significantly reduced size, by comparison with conventional, equivalent components. These highly compact MLCCs are available in values of 100µF and 47µF, ±20%, in 1206 and 0805 package sizes.
They are rated at 4.0V, and have a temperature characteristic of x5R. Their introduction by Dengrove follows the conclusion of a significant distribution agreement with manufacturer Taiyo Yuden, who have perfected the fusion of sub-micrometer thin-layer technology with 600-plus multilayer technology. This has achieved reduced chip surface areas as high as 36% and 55%, respectively, over the widely-used 1210- and 1206-packaged equivalents.
Typical applications include DC supply rail smoothing in the power circuitry of base stations and medical devices

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