They are rated at 4.0V, and have a temperature characteristic of x5R. Their introduction by Dengrove follows the conclusion of a significant distribution agreement with manufacturer Taiyo Yuden, who have perfected the fusion of sub-micrometer thin-layer technology with 600-plus multilayer technology. This has achieved reduced chip surface areas as high as 36% and 55%, respectively, over the widely-used 1210- and 1206-packaged equivalents.
Typical applications include DC supply rail smoothing in the power circuitry of base stations and medical devices
Multilayer Chip Capacitors from Dengrove
Dengrove has announced the introduction of high-value multilayer ceramic chip capacitors of significantly reduced size, by comparison with conventional, equivalent components.
These highly compact MLCCs are available in values of 100µF and 47µF, ±20%, in 1206 and 0805 package sizes.