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16 September 2026

Raytac Bluetooth Low Energy modules in TME's offer

Raytac Bluetooth Low Energy modules in TME's offer

Raytac Bluetooth Low Energy modules in TME’s offer

14 September 2026

Too cool to drift: how thermal engineering is redefining system stability

Too cool to drift: how thermal engineering is redefining system stability

Too cool to drift: how thermal engineering is redefining system stability

24 August 2026

Cadence Tensilica IP powers Analog Devices’ DSP architecture

Cadence Tensilica IP powers Analog Devices’ DSP architecture

Cadence Tensilica IP powers Analog Devices’ DSP architecture

20 September 2026

ROHM launches a MOSFET with industry-leading Wide-SOA

ROHM launches a MOSFET with industry-leading Wide-SOA

ROHM launches a MOSFET with industry-leading Wide-SOA

20 September 2026

Raising the bar for interconnect performance in military aircraft

Raising the bar for interconnect performance in military aircraft

Raising the bar for interconnect performance in military aircraft

19 September 2026

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Popular Searches

Trending Now

The next mode of transformation: 3D IC integration

ES Blog

16 September 2026

Raytac Bluetooth Low Energy modules in TME's offer

Raytac Bluetooth Low Energy modules in TME's offer

Raytac Bluetooth Low Energy modules in TME’s offer

14 September 2026

Too cool to drift: how thermal engineering is redefining system stability

Too cool to drift: how thermal engineering is redefining system stability

Too cool to drift: how thermal engineering is redefining system stability

24 August 2026

Cadence Tensilica IP powers Analog Devices’ DSP architecture

Cadence Tensilica IP powers Analog Devices’ DSP architecture

Cadence Tensilica IP powers Analog Devices’ DSP architecture

20 September 2026

ROHM launches a MOSFET with industry-leading Wide-SOA

ROHM launches a MOSFET with industry-leading Wide-SOA

ROHM launches a MOSFET with industry-leading Wide-SOA

20 September 2026

Raising the bar for interconnect performance in military aircraft

Raising the bar for interconnect performance in military aircraft

Raising the bar for interconnect performance in military aircraft

19 September 2026

Home Products Page 3751

National Instruments and LEGO Group Announce New Version of LEGO® MINDSTORMS® NXT Robotics Software

Test & Measurement

29 August 2007

1.5A and 1.2A step-down converters reduce solution size and simplify system design

Power

29 August 2007

250W 1U power supplies from Artesyn now available from UR Group

Power

29 August 2007

Four new standard colours added to the ergonomic 1553 soft-sided enclosure family

Enclosures

29 August 2007

Mini displacement joystick available from Aerco

Passives

29 August 2007

Digital Signage software offers flexibility to media designers

Displays

28 August 2007

Capacitive touch chip includes power management functions

Passives

28 August 2007

Vandal Proof Push Button Switches for Secure Applications

Passives

28 August 2007

Aonix ObjectAda Supports Windows Vista, .NET 2005

Design

27 August 2007

Express Logic Launches ThreadX MCU Edition for Microchip Technology’s PIC24 Microcontrollers and dsPIC® DSCs

Design

27 August 2007

STMicroelectronics Guarantees Full-Speed Operation of 32-Mbit Serial Flash Memory with Dual I/O

Memory

27 August 2007

30W UL1310 Class 2 LED Power with PFC Function

Power

27 August 2007

150W Miniature Enclosed Type Switching Power Supply

Power

27 August 2007

1U 500W U-Bracket Type Switching Power Supply

Power

27 August 2007

SMD thick film chip resistors from Panasonic

Passives

24 August 2007

40A quarter bricks now with 4:1 input range

Power

24 August 2007

Fanless PanelPC for embedded applications

Design

24 August 2007

STEADLANDS INTRODUCE THERMAL TRANSFER COMPOUND TO THEIR

Enclosures

24 August 2007

High-speed digitisers for PCi Bus from TTi

Test & Measurement

24 August 2007

600V/30A IGBT Improves Energy Efficiency in Low-Frequency Industrial Applications

Power

23 August 2007