Products

NVIDIA and xAI unveil Colossus, world’s largest AI supercomputer

• Artificial Intelligence

30 October 2024

byNews Desk

ESCATEC’s UV enhanced die bonder technology

• Design

30 October 2024

byNews Desk

Gold plating: better for flexible printed circuits

• Cables/Connecting

30 October 2024

byNews Desk

Farnell expands range of tools and production supplies

• Tools

30 October 2024

byNews Desk

Money-saving MCUs offer MPU performance

• Micros

30 October 2024

byNews Desk

Keysight and ADI partner to develop GMSLTM test methodology

• Test & Measurement

30 October 2024

byNews Desk

Infineon introduce DEEPCRAFT brand for Edge AI software solutions

• Artificial Intelligence

30 October 2024

byNews Desk

Bourns expands shielded power inductor portfolio

• Power

30 October 2024

byNews Desk

Toshiba and MIKROE introduce motor driving board

• Boards/Backplanes

29 October 2024

byNews Desk

New timing bundle from Vector and PLS

• Test & Measurement

29 October 2024

byNews Desk

Infineon unveils the thinnest silicon power wafer

• Power

29 October 2024

byNews Desk

Reyax introduces the RYB2340 BLE module

• Internet Of Things (IOT)

29 October 2024

byNews Desk

Anritsu achieves GCF validation

• 5G/6G

29 October 2024

byNews Desk

DENSO and Quadric sign AI semiconductor development agreement

• Artificial Intelligence

29 October 2024

byNews Desk

TASKING’s SmartCode supports development of AI-based applications

• Artificial Intelligence

29 October 2024

byNews Desk

CELUS goes global with simplified electronics design

• Design

29 October 2024

byNews Desk

3D printing medicine for children

• 3D Printing

29 October 2024

byNews Desk

Magnachip expands 7th generation MXT LV MOSFET production

• Power

29 October 2024

byNews Desk

MEMPHIS hands over DRAM modules to Intelligent Memory

• Memory

29 October 2024

byNews Desk

NXP expands Edge AI capabilities with new software tools

• Micros

29 October 2024

byNews Desk